Temperature-Compensated Oscillator Layout for Frequency Stability
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Solution Overview
Problem
Existing oscillators face challenges in accurately correcting the frequency of output signals due to temperature differences between temperature sensors and resonator elements, leading to degraded frequency accuracy.
Innovation Solution
The oscillator design incorporates a first container with a resonator element and temperature sensor housed together, along with a second container containing a frequency control circuit, where the containers are spaced and overlap each other, allowing for precise temperature compensation and reduced heat exchange, thereby minimizing temperature differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the temperature sensor is located outside the inner package, then the device complexity is reduced, but the temperature difference between the temperature sensor and the resonator element increases, degrading frequency accuracy
Solution Approach 1:
The patent applies nesting by placing the temperature sensor inside the inner package that houses the resonator element. The inner package is nested within the outer package, creating a hierarchical structure where the temperature sensor is positioned in close proximity to the resonator element, thereby minimizing temperature differences while maintaining a compact overall structure.
Solution Approach 2:
The patent utilizes vertical stacking in the Z-direction to arrange components. The outer package, inner package, and circuit elements are positioned at different heights, creating a three-dimensional layout that reduces planar footprint while maintaining functional separation and thermal coupling where needed.
2Volume of stationary object
If the second container and second circuit element are placed close together, then the volume is reduced, but heat exchange between them increases, affecting temperature measurement accuracy
Solution Approach 1:
The patent positions the second container (inner package) and second circuit element vertically stacked in the Z-direction with spacing between them. This three-dimensional arrangement reduces the planar footprint while maintaining thermal isolation through vertical separation, allowing compact packaging without compromising temperature measurement accuracy.
3Volume of stationary object
If the oscillator components are arranged in a compact layout, then the size is reduced, but the temperature distribution becomes non-uniform, degrading frequency stability
Solution Approach 1:
The patent employs vertical stacking of components in the Z-direction, creating a multi-layer configuration. The outer package, inner package, and circuit elements are arranged at different heights with appropriate spacing, achieving compact overall size while maintaining uniform temperature distribution through controlled thermal pathways and separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy of temperature compensation, resulting in an oscillator that outputs frequency signals with improved stability and reduced size.
Implementation Method 1
a temperature sensor accommodated in the second container, a first circuit element that is accommodated in the second container and includes an oscillation circuit that causes the resonator element to oscillate so as to generate an oscillation signal on which temperature compensation is performed based on a detected temperature of the temperature sensor
Implementation Method 2
the oscillator may further include a bypass capacitor disposed in the third recess portion. The second container may include a power supply terminal to which a power supply voltage for the oscillation circuit is applied, and the bypass capacitor may be coupled to the power supply terminal
Data Source
AI summary
An oscillator includes a first container, a second container accommodated in the first container, a resonator element accommodated in the second container, a temperature sensor accommodated in the second container, a first circuit element that is accommodated in the second container and includes an oscillation circuit that causes the resonator element to oscillate so as to generate an oscillation signal on which temperature compensation is performed based on a detected temperature of the temperature sensor, and a second circuit element which is accommodated in the first container and includes a frequency control circuit that controls a frequency of the oscillation signal. The second container and the second circuit element are spaced from each other and are disposed to overlap each other in plan view.