Oscillator Circuit Layout for Accurate Vibrator Temperature Compensation
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Solution Overview
Problem
In vibration devices, the temperature detected by the temperature sensor circuit deviates from the actual temperature of the vibrator due to heat generated by the output buffer circuit, leading to degradation in oscillation characteristics, as the heat is not effectively transmitted between the output buffer circuit and the vibrator in existing configurations.
Innovation Solution
A vibration device configuration where the temperature sensor circuit is placed closer to the through electrode than the output buffer circuit, allowing for quicker detection of the actual temperature of the vibrator and enabling effective temperature compensation, with the vibrator fixed directly to the semiconductor substrate via conductive joining members, facilitating heat transfer from the output buffer circuit to the vibrator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the temperature sensor circuit is placed close to the output buffer circuit to detect temperature quickly, then the temperature detection speed is improved, but the detected temperature deviates from the actual vibrator temperature due to heat interference
Solution Approach 1:
The patent introduces a heat shield (thermal insulation structure) as an intermediary between the output buffer circuit and the temperature sensor circuit. This heat shield blocks direct heat transmission from the high-power output buffer to the temperature sensor, allowing the sensor to detect the actual vibrator temperature rather than being influenced by buffer circuit heat, thus resolving the measurement accuracy issue while maintaining close proximity for fast detection
Solution Approach 2:
The patent segments the internal space of the oscillator housing into distinct thermal zones: one zone for the output buffer circuit with its own heat dissipation path, and another zone for the temperature sensor circuit isolated by the heat shield. This spatial segmentation allows each component to operate in its optimal thermal environment, enabling accurate temperature sensing without sacrificing detection speed
2Volume of moving object
If the output buffer circuit is placed close to the vibrator for compact design, then the device size is reduced, but heat transmission to the vibrator increases causing oscillation characteristic degradation
Solution Approach 1:
The heat shield serves as a thermal intermediary that selectively blocks heat transmission paths. It is positioned between the output buffer circuit and the vibrator to prevent harmful heat from reaching the vibrator, while allowing the compact layout to be maintained. This enables close placement of components for miniaturization without suffering from excessive heat interference
3Object-affected harmful factors
If the temperature sensor circuit is placed far from the through electrode to avoid heat, then heat interference is reduced, but the distance for temperature detection increases reducing detection accuracy
Solution Approach 1:
The heat shield enables the temperature sensor circuit to be positioned optimally for both heat avoidance and detection accuracy. By providing thermal blocking, the heat shield allows the sensor to be placed close to the through electrode and vibrator without being overwhelmed by heat from the output buffer, thus maintaining detection accuracy while avoiding heat interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures accurate temperature detection and compensation, reducing the occurrence of degradation in oscillation characteristics by ensuring the temperature sensor circuit can rapidly detect the temperature rise caused by the output buffer circuit, thereby improving the stability and precision of the vibration device.
Implementation Method 1
a through electrode that passes through a portion between the first and second surfaces... Dbx1 represents a distance between the output buffer circuit and the through electrode
Implementation Method 2
a vibrator fixed to the first surface via an electrically conductive joining member
Data Source
AI summary
A vibration device includes a base including a semiconductor substrate and through electrodes that pass through the portion between first and second surfaces of the semiconductor substrate, and a vibrator fixed to the first surface via an electrically conductive joining member. The following components are placed at the second surface: an oscillation circuit that is electrically coupled to the vibrator via the through electrodes and generates an oscillation signal by causing the vibrator to oscillate, a temperature sensor circuit, a temperature compensation circuit that performs temperature compensation on the oscillation signal, and an output buffer circuit that outputs a clock signal based on the oscillation signal. Dsx1<Dbx1, a distance between the output buffer circuit and one of the through electrodes is Dbx1, a distance between the temperature sensor circuit and the other through electrode is Dsx1.