Oscillator Lid Insulation via Terminal Relocation
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Solution Overview
Problem
Existing oscillators with quartz crystal resonators face instability in output frequency due to external temperature fluctuations, as air enters the package through a missing portion in the lid, affecting the thermostatic chamber's temperature control.
Innovation Solution
The oscillator design includes a substrate with cutout portions and side surface wiring, filled with a filling member and coated with an insulating coating, preventing electrical contact between the lid and internal components, thus eliminating the need for a missing portion and enhancing heat insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a missing portion is provided in the lid to prevent contact with internal terminals, then electrical contact prevention is improved, but heat insulation deteriorates and temperature stability worsens
Solution Approach 1:
The patent moves the internal terminal from the upper surface (2D plane) to the lower surface of the base substrate, changing its spatial dimension. This allows the lid to be positioned higher without risk of contact, eliminating the need for a missing portion while maintaining electrical isolation and improving thermal insulation.
Solution Approach 2:
The patent introduces an insulating coating layer as an intermediary between the lid and the internal terminal. This coating layer provides electrical isolation, allowing the lid to be positioned closer to the terminal without risk of contact, thereby eliminating the need for a missing portion while maintaining thermal insulation.
2Ease of manufacture
If the internal terminal is exposed on the upper surface of the base substrate, then electrical connection is improved, but the need for a missing portion increases structural complexity
Solution Approach 1:
The patent inverts the conventional arrangement by placing the internal terminal on the lower surface of the base substrate instead of the upper surface. This inversion eliminates the need for a missing portion in the lid, simplifying the lid structure while maintaining electrical connection functionality through the side surface wiring.
3Ease of manufacture
If outside air enters the package through a missing portion, then ease of manufacturing is improved, but frequency stability deteriorates
Solution Approach 1:
The patent extracts the internal terminal from the upper surface area and relocates it to the lower surface, removing the need for a missing portion in the lid. This eliminates the pathway for outside air to enter the package, thereby improving frequency stability while maintaining ease of manufacturing through simplified lid structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes the output frequency by maintaining the thermostatic chamber's temperature within a predetermined range, reducing the impact of external temperature changes and improving frequency precision.
Implementation Method 1
an insulating coating member provided on the first substrate body main surface
Implementation Method 2
a filling member provided in the cutout portion
Implementation Method 3
a lid body bonded to the substrate and including a metal material
Data Source
AI summary
An oscillator includes a substrate having a first substrate main surface and a substrate side surface, and a lid body bonded to the substrate and including a metal material, in which the substrate includes a substrate body having a first substrate body main surface corresponding to the first substrate main surface and a substrate body side surface corresponding to the substrate side surface, and provided with a cutout portion in the substrate body side surface, a side surface wiring provided along the cutout portion, a filling member provided in the cutout portion, and an insulating coating member provided on the first substrate body main surface.