Oscillator Nested Sensor for Frequency Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing oscillators face challenges in accurately correcting output signal frequency due to temperature differences between the temperature sensor and the resonator element, leading to reduced frequency accuracy.
Innovation Solution
The oscillator design incorporates a second container within the first container, housing both the resonator element and temperature sensor, with a frequency control circuit and oscillation circuit, allowing for accurate temperature compensation and reduced heat transfer between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the temperature sensor is located outside the inner package that accommodates the resonator element, then the device complexity is reduced and ease of manufacture is improved, but a temperature difference between the temperature sensor and the resonator element occurs, reducing measurement precision and frequency accuracy
Solution Approach 1:
The patent places the temperature sensor inside the inner package that accommodates the resonator element, nesting both components within the same housing structure. This ensures they share the same thermal environment and eliminates temperature differences between them, resolving the measurement precision issue while maintaining ease of manufacture through integrated packaging.
2Device complexity
If the temperature sensor is located outside the inner package, then device complexity is reduced, but frequency accuracy deteriorates due to temperature differences
Solution Approach 1:
The temperature sensor is nested within the inner package alongside the resonator element, ensuring both components experience identical temperature conditions. This nesting approach maintains simple device structure while achieving high frequency accuracy through precise temperature measurement at the resonator's location.
3Ease of manufacture
If circuit elements are arranged side by side with the inner package, then ease of manufacture is improved, but heat transfer between components increases, affecting temperature measurement accuracy
Solution Approach 1:
The patent extracts the frequency control circuit from the inner package and places it in a separate location on the circuit board. This separation removes the heat-generating frequency control circuit from proximity to the temperature sensor and resonator element, eliminating heat transfer interference while maintaining ease of manufacture through modular circuit board layout.
Solution Approach 2:
The patent introduces thermal insulation structures and spacing as intermediaries between the inner package containing the temperature sensor and the frequency control circuit. These intermediary elements block heat transfer paths from the frequency control circuit to the temperature sensor, preventing thermal interference while allowing both components to coexist in the same device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature detection and compensation, resulting in a highly accurate frequency signal output with minimized frequency deviation due to temperature variations.
Implementation Method 1
a temperature sensor (71) accommodated in the second container... generating an oscillation signal (out signal) on which temperature compensation is performed based on a detected temperature (detected value) of the temperature sensor (71)
Data Source
AI summary
An oscillator includes a first container that includes a first base substrate and a first lid bonded to the first base substrate and has a first internal space, a second container that is accommodated in the first internal space and fixed to the first base substrate, a resonator element that is accommodated in the second container, a temperature sensor that is accommodated in the second container, a first circuit element that is accommodated in the second container and includes an oscillation circuit oscillating the resonator element and generating an oscillation signal on which temperature compensation is performed based on a detected temperature of the temperature sensor, and a second circuit element that is fixed to the first base substrate and includes a frequency control circuit that controls a frequency of the oscillation signal, in which the second container and the second circuit element are arranged side by side in plan view.


