Oscillator Package Insulating Projections for Frequency Stability
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Solution Overview
Problem
Existing oscillators, such as piezoelectric oscillators, face issues with frequency stability due to temperature fluctuations caused by direct contact between the circuit board and the base member, leading to reduced accuracy in temperature control.
Innovation Solution
An electronic component package with insulating projecting portions on the base member that maintain a predetermined gap with the substrates, reducing heat conduction and allowing for precise temperature control, thereby enhancing frequency stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is connected to the lower lid cover through lead terminals without positioning, then the assembly is simple, but the circuit board contacts the lower lid cover causing heat conduction and frequency instability
Solution Approach 1:
The patent introduces an insulating member as an intermediary between the lower lid cover and the circuit board. This insulating member prevents direct contact and heat conduction while maintaining the electrical connection through lead terminals, thus resolving the contradiction between simplicity and frequency stability.
Solution Approach 2:
The patent extracts the heat conduction path by removing the direct contact between the metal lower lid cover and the circuit board. By taking out the harmful thermal interaction while preserving the electrical connection function, the frequency stability is improved without significantly increasing complexity.
2Temperature
If the circuit board contacts the lower lid cover, then the structure is compact, but heat conduction occurs degrading temperature control accuracy
Solution Approach 1:
The insulating member serves as a thermal barrier between the lower lid cover and the circuit board, preventing heat conduction while maintaining compact packaging. This intermediary allows the package to remain space-efficient while achieving accurate temperature control of the resonator element.
3Reliability
If the resonator element is affected by outside temperature changes, then the package structure is simple, but frequency stability is degraded
Solution Approach 1:
The insulating member acts as a thermal intermediary that blocks the transmission of outside temperature changes to the resonator element. This simple yet effective barrier prevents harmful thermal influences while maintaining the overall simplicity of the package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature-induced frequency fluctuations, ensuring high accuracy and reliability in oscillators, electronic apparatuses, and base stations by minimizing heat transfer and maintaining precise substrate positioning.
Implementation Method 1
a first projecting portion projecting from one surface of the base member, contacting a first substrate on which an electronic component is mounted, and having an insulating property
Data Source
AI summary
A package includes a base member and a first projecting portion that projects from one surface of the base member. The first projecting portion contacts a first substrate on which an electronic component is mounted, and has an insulating property.