Oscillator Thermal Isolation for Frequency Accuracy

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Solution Overview

Problem

Existing oscillators face challenges in accurately correcting output signal frequency due to temperature differences between the temperature sensor and vibration element, leading to decreased frequency accuracy.

Innovation Solution

The oscillator design includes an inner package with a vibration element and temperature sensor, and a heat insulating member to separate the inner and outer packages, preventing heat transfer and maintaining accurate temperature detection, along with a second circuit element for frequency control using a PLL circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the temperature sensor is placed outside the inner package, then the device complexity is reduced, but the temperature measurement precision deteriorates due to temperature difference between sensor and vibration element

Engineering Contradiction:
Improvedevice complexityVSAvoidtemperature measurement precision
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The temperature sensor is nested inside the inner package, placing it in close proximity to the vibration element. This nested configuration allows the sensor to accurately measure the temperature of the vibration element without requiring external packaging or additional structural complexity, thereby resolving the contradiction between device simplicity and measurement precision.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The temperature sensor and vibration element are merged into the same inner package structure, eliminating the temperature differential that would exist if they were separated. This merging ensures both components experience the same thermal environment, improving temperature measurement accuracy while maintaining a compact, integrated design.

Inventive Principle:
Principle #5Merging (Combining)

2Device complexity

If the inner package is fixed directly to the outer package, then the structural complexity is reduced, but the temperature stability deteriorates due to heat transfer from the outer package

Engineering Contradiction:
Improvestructural complexityVSAvoidtemperature stability
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

A heat insulating member is introduced as an intermediary between the inner package and outer package. This mediator blocks heat transfer from the outer package to the inner package, stabilizing the temperature of the vibration element and temperature sensor without requiring complex active temperature control systems or additional structural elements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat insulating member converts the potentially harmful heat transfer from the outer package into a beneficial thermal isolation effect. By blocking the heat flow, the insulating member creates a stable thermal environment for the vibration element, turning the thermal challenge into a temperature stability advantage.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures precise temperature compensation and minimizes frequency deviation, resulting in a highly accurate frequency signal output.

Implementation Method 1

an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member

Methodology Applied
Scientific EffectThermal Insulation: Thermal Insulation

Data Source

PatentUS11522496B2Oscillator
Publication Date: 2022.12.06 SEIKO EPSON CORP
  • US11522496B2 patent drawing
  • US11522496B2 patent drawing
  • US11522496B2 patent drawing

AI summary

An oscillator includes: an outer package; an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a temperature sensor; a first circuit element accommodated in the inner package and including an oscillation circuit configured to oscillate the vibration element and generate a temperature-compensated oscillation signal based on the temperature sensor; and a second circuit element fixed to the outer package and including a frequency control circuit configured to control a frequency of the oscillation signal.