Semiconductor Package Oscillator Thermal Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor device packages face challenges in achieving compact size, reduced thickness, and improved operational stability due to thermal interference and compatibility issues between components like controllers and oscillators, which affect storage performance and compatibility with host systems.
Innovation Solution
A semiconductor device package design that integrates a substrate with a connector, nonvolatile memory, memory controller, and oscillator, where the oscillator is electrically connected to the memory controller and sealed with a resin to reduce thermal interference and enhance compatibility, using a System-in-Package (SiP) configuration with optimized component placement and bonding wires for efficient heat dissipation and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are integrated in the same package, then device compactness is improved, but thermal interference between components increases
Solution Approach 1:
The patent divides the internal package structure into distinct regions: a first region housing the controller and a second region housing the oscillator. This spatial segmentation isolates thermally sensitive components from heat-generating components, reducing thermal interference while maintaining package compactness.
Solution Approach 2:
The patent introduces a heat dissipation structure (heat sink) as an intermediary element between the controller and oscillator. This mediator captures and dissipates heat away from sensitive components, enabling close integration without excessive thermal interference.
2Length of stationary object
If components are placed closer together, then device thickness is reduced, but operational stability decreases due to thermal effects
Solution Approach 1:
The package is segmented into vertically stacked regions with the controller in a first region and the oscillator in a second region. This vertical segmentation allows reduced device thickness while maintaining adequate thermal separation through the layered structure.
Solution Approach 2:
A heat dissipation structure is positioned between the controller and oscillator to act as a thermal buffer. This intermediary enables closer component placement for reduced thickness while protecting the oscillator from thermal effects that would compromise operational stability.
3Volume of moving object
If oscillator is sealed with resin, then device compactness is improved, but heat dissipation from oscillator may be affected
Solution Approach 1:
The package structure segments the oscillator into a sealed region (for compactness and protection) and a heat dissipation region. The heat dissipation structure extends from the sealed oscillator region to an external surface, allowing compact sealing while maintaining thermal pathways for effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact, thin semiconductor device with improved operational stability, reduced heat transfer to sensitive components, and enhanced compatibility with host systems, addressing thermal and compatibility issues while maintaining high storage performance.
Implementation Method 1
a seal member sealing the nonvolatile semiconductor memory device, the memory controller, and the oscillator on the surface of the substrate
Implementation Method 2
bonding wires for efficient heat dissipation and signal integrity
Implementation Method 3
optimized component placement and bonding wires for efficient heat dissipation
Data Source
AI summary
A semiconductor device package includes a substrate including, on an edge thereof, a connector that is connectable to a host, a nonvolatile semiconductor memory device disposed on a surface of the substrate, a memory controller disposed on the surface of the substrate, an oscillator disposed on the surface of the substrate and electrically connected to the memory controller, and a seal member sealing the nonvolatile semiconductor memory device, the memory controller, and the oscillator on the surface of the substrate.