Oscilloscope Probe Voltage Divider Integration
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Solution Overview
Problem
Existing oscilloscope probes face limitations in miniaturization and bandwidth due to parasitic effects from input-voltage dividers constructed with discrete components or thick-layer technology, which also lead to oscillations when not matched correctly at low impedance.
Innovation Solution
The oscilloscope probe integrates at least part of the input-voltage divider with the transistor amplifier on a semiconductor substrate using integrated-circuit technology, allowing for adjustment and minimizing parasitic elements, thus reducing the probe's dimensions and enhancing bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the input-voltage divider is constructed with discrete components or thick-layer technology, then the probe can be assembled with conventional techniques, but the probe dimensions cannot be miniaturized and parasitic elements increase
Solution Approach 1:
The patent merges the input-voltage divider and amplifier into a single integrated circuit structure. The voltage divider elements (resistors and capacitors) are directly formed on the semiconductor substrate alongside the amplifier transistor, eliminating the need for separate discrete components and interconnect wires. This integration reduces the overall probe dimensions while minimizing parasitic elements.
2Productivity
If discrete components or thick-layer technology are used for the voltage divider, then manufacturing is simpler with conventional techniques, but bandwidth is limited due to parasitic inductances and capacitances
Solution Approach 1:
The patent extracts and eliminates the harmful parasitic inductances and capacitances that arise from discrete component interconnects. By integrating the voltage divider directly into the semiconductor substrate with the amplifier, the design removes the unnecessary wire bonds and separate component mounting that generate parasitic effects. The result is a clean signal path capable of operating at bandwidths up to 10 GHz.
3Reliability
If the amplifier input is connected to the input divider via bonding wire, then assembly is simplified, but high impedance at high frequencies causes oscillations
Solution Approach 1:
The patent combines the amplifier input connection and voltage divider into a single integrated structure on the semiconductor substrate. The amplifier transistor and voltage divider elements share the same substrate without requiring external bonding wires. This eliminates the high-impedance bonding wire connection that causes oscillations at high frequencies, replacing it with direct low-impedance connections through the integrated circuit structure.
Data Source
AI summary
In an oscilloscope probe with a transistor amplifier constructed on a semiconductor substrate using integrated circuit technology, at least one part of the input-voltage divider is also constructed together with the amplifier using integrated-circuit technology on the semiconductor substrate.