OSM-L Computer-on-Module Integration for Stable Thermal Design
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Solution Overview
Problem
Current computer systems lack a universal industrial standard for integrating CPU, memory, and power supply, leading to complex designs, increased development time, and reduced system stability.
Innovation Solution
A micro all-in-one computer chip system based on the OSM-L standard, integrating a CPU, memory, and power supply circuit into a 45mm x 45mm microcomputer chip, with a highly integrated circuit design and an OSM-L interface for efficient communication and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If CPU, memory and power supply are arranged in a limited space to maintain electromagnetic equilibrium, then component integration is achieved, but design complexity increases and development time extends
Solution Approach 1:
The patent merges CPU, memory, and power supply into a single integrated chip package, reducing the number of separate components and interconnections. This consolidation directly addresses the technical contradiction by achieving component integration while simultaneously reducing design complexity through standardized internal architecture and simplified external interfaces.
Solution Approach 2:
The integrated chip is designed with universal interfaces and standardized configurations that can be applied across multiple application scenarios. The chip incorporates multiple functional units (CPU cores, memory modules, power management circuits) that can be configured for different uses, thereby achieving adaptability while maintaining manageable design complexity through reuse of proven architectural patterns.
2Area of stationary object
If CPU, memory and power supply are arranged in a limited space, then space efficiency is improved, but system stability may be compromised due to electromagnetic interference
Solution Approach 1:
The patent applies local quality principles by creating distinct functional zones within the integrated chip for CPU, memory, and power supply components. Each zone is optimized for its specific function with appropriate electromagnetic shielding and isolation measures localized to critical areas, thereby maintaining small chip area while ensuring system stability through targeted electromagnetic interference mitigation.
Solution Approach 2:
The patent introduces intermediary structures such as ground planes, shielding layers, and isolation circuits between the CPU, memory, and power supply components. These intermediaries act as buffers to prevent electromagnetic interference between components, enabling compact integration while maintaining system reliability through active electromagnetic compatibility management.
3Adaptability or versatility
If a universal industrial standard for integrating CPU, memory and power supply is not established, then design flexibility is maintained, but development time increases
Solution Approach 1:
The patent establishes a universal industrial standard through standardized interface definitions, pin configurations, and electrical characteristics for the integrated chip. This standardization enables design flexibility by allowing the same chip architecture to be used across multiple applications and platforms, while simultaneously reducing development time through reuse of reference designs, validated interfaces, and proven integration patterns.
Solution Approach 2:
The patent performs preliminary action by pre-defining standardized interfaces, communication protocols, and integration guidelines in the universal standard documentation. This advance preparation allows system designers to quickly integrate the chip into their projects without needing to perform extensive interface design and validation work, thereby maintaining design flexibility while significantly reducing development time.
4Device complexity
If CPU, memory and power supply are integrated into a single chip, then device complexity is reduced, but heat dissipation becomes more challenging
Solution Approach 1:
The patent addresses heat dissipation challenges by transitioning from two-dimensional planar heat management to three-dimensional thermal management. The integrated chip employs vertical heat sinks, through-silicon vias for heat conduction, and multi-layer thermal pathways that extend heat dissipation into the third dimension, thereby reducing system complexity through integration while effectively managing the increased thermal density.
Solution Approach 2:
The patent uses composite materials with high thermal conductivity in the chip packaging and heat spreader layers. The integrated chip structure incorporates thermally conductive interface materials, metal heat spreaders, and phase change materials that efficiently conduct and distribute heat away from the dense component arrangement, enabling simplified integration while maintaining acceptable operating temperatures through advanced thermal management materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies computer design, reduces development time, improves system stability, and enables efficient integration of various I/O devices, while providing effective heat dissipation and scalability for high-performance applications.
Implementation Method 1
the accommodation gap being formed between the enclosure cover and the system circuit carrier board, the system on a chip (SoC), the memory system and the power circuit module, and coated and filled with a thermal paste
Data Source
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AI summary
A micro all-in-one computer chip system (1) based on OSM-L standard includes: a 45mm*45mm system circuit carrier board (10) with a top layer (11) and a bottom layer (12), the top layer (11) having an integrated circuit (111) with a highly integrated circuit design, and the bottom layer (12) having an OSM-L interface (121) defined by SGeT; a system on a chip (20), a memory system (30) and a power circuit module (40) which are electrically connected and installed to the top layer (11) of the carrier board (10); and an enclosure cover (50), being hollow at the bottom of the enclosure cover (50) and having a containing space (53) provided for installing the system circuit carrier board (10), and a thermal paste being coated and filled into the accommodation gap (54) of the enclosure cover (50). In this way, it becomes a micro all-in-one computer chip system (1) with complete functions, and enables the micro all-in-one computer chip system (1) to be widely used in industrial computer, Internet of Things, edge computing, artificial intelligence, and various applications as a chip/IC, and becomes the standard for the development and operation among industries.