Ostomy Adhesive Wafer Zone Thickness for Removal

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Solution Overview

Problem

Existing ostomy adhesive wafers are difficult to remove from the skin due to their thin design, which makes them challenging for users to peel off comfortably.

Innovation Solution

The ostomy appliance features an adhesive wafer with distinct zones, where the third zone is significantly thicker than the second zone, facilitating easier detachment by providing a tactile identification and grip point, and incorporating a notch for a rolling motion to aid in peeling, allowing for a combination of thin wafer comfort and easy removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the adhesive wafer is made thin for comfort, then user comfort is improved, but ease of removal deteriorates

Engineering Contradiction:
Improveease of removalVSAvoidthickness of adhesive wafer
Core Design Contradiction:
Ease of operationVSLength of moving object

Solution Approach 1:

The adhesive wafer is divided into multiple zones with different thicknesses: a first zone (central area) with thin thickness for comfort, and a second zone (peripheral area) with greater thickness for ease of removal. This segmentation allows each zone to serve its specific function independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the adhesive wafer are given different local properties: the central first zone maintains thin thickness to be comfortable and unnoticeable during body movements, while the peripheral second zone has increased thickness to provide tactile identification and grip points for easy removal by the user.

Inventive Principle:
Principle #3Local quality

2Ease of operation

If the adhesive wafer is made thin for comfort, then comfort during movement is improved, but difficulty of peeling increases

Engineering Contradiction:
Improveease of peelingVSAvoidstructural complexity of adhesive wafer
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The adhesive wafer structure is segmented into functional zones with different thicknesses, adding complexity only where needed at the periphery while keeping the central area simple and thin for comfort.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The increased thickness and structural features are applied locally only to the peripheral second zone where they are needed for peeling, rather than throughout the entire wafer, thus minimizing overall structural complexity.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP2726031B1An ostomy appliance
Publication Date: 2015.08.12 COLOPLAST AS
  • EP2726031B1 patent drawingFigure 1~2
  • EP2726031B1 patent drawingFigure 3
  • EP2726031B1 patent drawingFigure 4

AI summary

An ostomy appliance comprising an adhesive wafer (100), which comprises a first, a second and a third zone (102, 104, 106). The third zone defines at least a part of the outer rim (110) of the adhesive wafer and the second zone encirculates the first zone.