OTA Chip Test Socket Alignment for Accurate RF Contact
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Solution Overview
Problem
Current test equipment for semiconductor devices and integrated circuits faces challenges in accurately testing high-frequency components without signal loss and interference, particularly due to the complexity of making low resistance, non-destructive electrical contact and the difficulty in accessing RF ports located on the bottom side of ICs, which often results in incorrect identification of defective devices.
Innovation Solution
A test apparatus featuring a gripper assembly with an elastic member and alignment plate to securely hold and align the device under test, allowing for reliable electrical connection and RF testing without interference, using a socket to connect the device to a load board and a retractor to facilitate easy release, enabling precise testing of semiconductor devices with antennas on various surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If test equipment makes electrical contact with closely spaced contacts in semiconductor devices, then testing capability is achieved, but connection accuracy deteriorates due to small contact size and spacing
Solution Approach 1:
The test equipment uses a load board with multiple sockets, each socket having individual contact elements that can be independently positioned and adjusted. This segmentation allows precise alignment with each contact on the semiconductor device, maintaining connection accuracy while enabling testing of multiple devices simultaneously.
Solution Approach 2:
The patent introduces a load board as an intermediary component between the test equipment and the semiconductor device. The load board contains sockets that provide stable, precise electrical contact with the device contacts, mediating the connection and eliminating direct contact errors between the test equipment and the device under test.
2Adaptability or versatility
If RF ports are located on the bottom side of ICs for high frequency testing, then testing functionality is achieved, but accessibility deteriorates due to occlusion by test housing and load board
Solution Approach 1:
The patent positions the RF ports and antenna elements in three-dimensional space such that the bottom-side RF ports are accessible from below the load board while the antenna extends upward. This dimensional arrangement allows simultaneous access to both bottom-side RF ports and top-side antenna without interference from the test housing.
Solution Approach 2:
The design nests the semiconductor device within the load board socket, with the antenna extending through or above the load board structure. This nested arrangement allows the RF testing equipment to access bottom-side ports while the antenna remains accessible for over-the-air testing, solving the occlusion problem.
3Measurement precision
If pickup receivers are placed close to RF emitters for proper RF coupling, then signal coupling quality improves, but device complexity increases due to space constraints
Solution Approach 1:
The patent extracts the RF reception function from the traditional contact-based test method and implements it through over-the-air antenna coupling. The pickup receivers are positioned to couple with the antenna radiated fields rather than requiring direct physical proximity to the RF emitters, simplifying the spatial arrangement while maintaining coupling quality.
Data Source
AI summary
A test apparatus for testing device under test (DUT) having an antenna located on the DUT is disclosed. The test apparatus includes: a housing, a socket configured to electrically connect the DUT to a load board, a gripper assembly configured to hold the DUT in place, a retractor configured to release the DUT from the gripper assembly, and an alignment plate configured to align the DUT with the socket. The gripper assembly includes a base and an extender, the base is attached to the housing, and the extender is configured to hold the DUT in place. When the retractor is disengaged from the extender, the extender is configured to hold the DUT in place. When the retractor is engaged with the extender, the extender is configured to release the DUT on the alignment plate.