Outer Electrode Dry Film Structure for Solder-Free Mounting
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Solution Overview
Problem
Existing electronic components face issues with soldering and plating methods that lead to reduced quality, such as cracking due to thermal shrinkage, corrosion of ceramic bodies, and decreased insulation resistance, particularly in high-temperature environments.
Innovation Solution
An electronic component design featuring an outer electrode with a non-electrically connected outermost layer formed using a conductive paste that includes metal particles and a solvent, which is dried to form a dry film without sintering, allowing mounting on a circuit board without soldering or plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder and plating are used for mounting electronic components, then electrical connection and bonding are achieved, but metallization dissolution occurs and adhesion decreases due to oxidation
Solution Approach 1:
The patent extracts and eliminates the solder and plating layers from the mounting structure. The external electrode is designed to directly contact the circuit board land pattern without intermediate solder or plating layers, thereby removing the sources of metallization dissolution and oxidation while maintaining electrical connection functionality
Solution Approach 2:
The patent introduces a barrier layer as an intermediary between the external electrode and the circuit board land pattern. This barrier layer prevents direct interaction between the electrode and solder flux, eliminating metallization dissolution and oxidation while still allowing electrical connection through the land pattern contact
2Strength
If solder is used for mounting, then bonding is achieved, but heat resistance is insufficient in high-temperature environments
Solution Approach 1:
The patent changes the material parameters of the mounting structure by replacing solder with a barrier layer and direct land pattern contact. The barrier layer is designed to withstand high temperatures without degrading, while the land pattern provides mechanical bonding strength through direct contact with the external electrode
Solution Approach 2:
The patent eliminates the use of solder, which has limited thermal stability, and replaces it with a durable barrier layer structure that maintains its integrity at high temperatures. The barrier layer serves as a permanent, heat-resistant bonding interface rather than a consumable solder joint
3Reliability
If flux is included in solder for removing oxide films, then adhesion is improved, but corrosion of ceramic body occurs and insulation resistance decreases
Solution Approach 1:
The patent extracts and eliminates the flux component from the mounting system by removing solder entirely. The barrier layer structure provides adhesion without requiring flux, thereby preventing corrosion of the ceramic body and maintaining insulation resistance
Solution Approach 2:
The barrier layer acts as an intermediary that provides the necessary adhesion function without requiring corrosive flux. It creates a protective interface between the external electrode and the circuit board, eliminating the need for flux-induced bonding while preventing corrosion of ceramic components
4Ease of manufacture
If plating solution is used for plating, then outer electrode formation is achieved, but acid or alkali corrodes the ceramic body and insulation resistance decreases
Solution Approach 1:
The patent extracts and eliminates the plating process from the manufacturing sequence. The external electrode is formed directly on the ceramic body without requiring plating solutions, thereby removing the source of acid or alkali corrosion while maintaining electrode formation capability
Solution Approach 2:
The barrier layer serves as an intermediary protective layer during the electrode formation process. It prevents direct contact between the ceramic body and any potentially corrosive materials, enabling safe electrode formation without plating solutions that would otherwise corrode the ceramic and reduce insulation resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents quality reduction by eliminating soldering and plating issues, enabling reliable connections and maintaining insulation resistance, while allowing fine pitch and high-density mounting.
Implementation Method 1
an outermost-layer-forming conductive paste including metal particles and a solvent is applied to a surface, and subsequently, the outermost-layer-forming conductive paste is dried at a temperature at which the solvent evaporates but sintering of the metal particles does not begin
Implementation Method 2
a two-stage firing process to sinter the metal particles and decompose the resin
Implementation Method 3
a two-stage firing process to sinter the metal particles and decompose the resin
Data Source
AI summary
An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.