Outer Nozzle Position Control for Wafer Liquid Film Coverage
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Solution Overview
Problem
Existing substrate processing systems for semiconductor wafers face limitations in flexibly adjusting the discharge flow rate of processing liquids from outer nozzles, which are immovably fixed, leading to inflexible coverage of the central substrate area during liquid processing.
Innovation Solution
Incorporating an actuator to adjust the height position or discharge angle of the outer nozzle, allowing for flexible control of the discharge flow rate and ensuring the processing liquid covers the central substrate area effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the outer nozzle is immovably fixed to supply processing liquid to the central portion of the substrate, then the central portion is covered with liquid film, but the discharge flow rate cannot be changed flexibly
Solution Approach 1:
The outer nozzle is made movable along the radial direction of the substrate instead of being fixed. The actuator enables the nozzle to change its position dynamically, allowing flexible adjustment of discharge flow rate by changing the distance between the nozzle and substrate center, while maintaining the function of covering the central portion with liquid film.
2Ease of operation
If the outer nozzle is fixed at a specific position, then the structure is simple, but the arrival position of processing liquid is entirely determined by discharge flow rate
Solution Approach 1:
The nozzle position is made dynamically adjustable along the radial direction. By changing the nozzle's radial position, the arrival position of processing liquid on the substrate can be controlled independently of the discharge flow rate, enabling both ease of operation and processing efficiency.
Solution Approach 2:
The control of processing liquid delivery is separated into two independent functions: discharge flow rate control and arrival position control. The actuator handles position control while the discharge flow rate is controlled separately, allowing independent optimization of both parameters for improved processing efficiency.
3Adaptability or versatility
If the outer nozzle is used to suppress substrate drying, then the central portion is covered, but the flow rate cannot be adjusted according to different processing requirements
Solution Approach 1:
The outer nozzle system incorporates an actuator that enables dynamic radial movement. This allows the discharge flow rate to be adjusted adaptively for different processing conditions by changing the nozzle-to-substrate distance, while the overall system remains relatively simple in structure.
Data Source
AI summary
A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.