Outer Packaging Through Holes for Chip Access

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Solution Overview

Problem

The existing consumable package assembly process requires the removal and reassembly of outer packaging portions to update or reset the chip on consumable containers, leading to increased costs and reduced production efficiency due to unnecessary scrapping and additional procedures.

Innovation Solution

The design includes an outer packaging portion with specific through holes that allow for the exposure and positioning of the chip without removing the packaging, enabling operations to be performed directly on the chip without disassembling the package, thereby preventing unnecessary scrapping and streamlining the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the outer packaging portion is removed and reassembled to operate the chip on the consumable container, then the chip operations can be performed, but the outer packaging portion is scrapped and production efficiency is reduced

Engineering Contradiction:

Improvechip operationVSAvoidproduction efficiency

Core Design Contradiction:

Ease of operationVSProductivity

Solution Approach 1:

The outer packaging portion is segmented with two distinct through holes: a first through hole for chip operation and a second through hole for positioning. This segmentation allows different operations to be performed through separate openings, enabling chip operations without removing the packaging while maintaining positioning accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first through hole acts as an intermediary that allows the chip device to access and operate the chip on the consumable container without requiring removal of the outer packaging portion. This mediator enables the operation while preserving the packaging structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If the outer packaging portion is removed and reassembled to operate the chip, then the chip can be accessed, but additional procedures are added and costs increase

Engineering Contradiction:

Improvechip accessVSAvoidprocedure complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The packaging is divided into functional zones with dedicated through holes for different operations. The first through hole is specifically designed for chip access, allowing the chip device to reach the chip without requiring complete disassembly or complex reassembly procedures.

Inventive Principle:

Principle #1Segmentation

3Stability of the object's composition

If the consumable container is positioned without through holes in the outer packaging, then the packaging remains intact, but accurate positioning cannot be achieved

Engineering Contradiction:

Improvepackaging integrityVSAvoidpositioning accuracy

Core Design Contradiction:

Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second through hole extracts only the necessary positioning function from the packaging structure, allowing the positioning feature to be accessed while the rest of the packaging remains intact and protective.

Inventive Principle:

Principle #2Taking out (Extraction)

4Productivity

If the outer packaging portion is designed with through holes for chip exposure and positioning, then chip operations can be performed without removal, but the packaging structure becomes more complex

Engineering Contradiction:

Improveproduction efficiencyVSAvoidpackaging structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The outer packaging portion is designed with multi-functionality: it provides protection, enables chip operation through the first through hole, and ensures accurate positioning through the second through hole. This multi-functionality consolidates multiple requirements into a single packaging structure, improving efficiency without proportionally increasing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12257848B2Consumable package assembly

Publication Date: 2025.03.25 ZHUHAI NINESTAR MANAGEMENT CO LTD

AI summary

Provided is a consumable package assembly including a consumable container and an outer packaging portion. The consumable container includes a chip, and the outer packaging portion includes an accommodating portion for accommodating the consumable container. The outer packaging portion includes a first through hole configured to expose at least a part of the chip, and a second through hole configured to expose at least apart of the accommodating portion so as to position the consumable container. Operation to the chip on the consumable container can be performed without removing the outer packaging portion so as to avoid scrapping of the outer packaging portion, thereby reducing the procedures of the production or the reprocessing and resulting in lower cost and higher efficiency. The second through hole is configured to prevent the unfixed position of the consumable container in the outer packaging portion from resulting inaccurate operation to the chip.