Process Chamber Outlet Nozzle Barrier Against Particle Backflow
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Solution Overview
Problem
In semiconductor process chambers, uncontrolled temperature and pressure conditions can lead to poor uniformity and contamination of semiconductor wafers, resulting in undesirable performance or scrap, especially during alarm situations where the pump is inoperable and the outflow channel cannot be closed, allowing particles or fluids to reenter the chamber.
Innovation Solution
A nozzle array is implemented within the outflow channel to create a protective fluid barrier using inert gases, such as argon or nitrogen, which outputs fluid in a horizontal and rotational direction to prevent backflow of particles, fluids, or materials into the interior volume, maintaining a controlled environment even during pump failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If equipment is operated continuously in semiconductor process chambers, then productivity is improved, but reliability deteriorates due to potential pump failures and contamination risks
Solution Approach 1:
The fluid barrier is generated in advance before contamination can occur. When the pump system detects a failure or alarm condition, the nozzle array immediately activates to create a protective fluid barrier in the vacuum pathway, preventing contamination before it can affect the semiconductor wafer or chamber environment.
Solution Approach 2:
An inert gas fluid acts as an intermediary barrier between the contaminated environment (outside the chamber or pump system) and the clean semiconductor processing environment. This fluid barrier mediates the potential contamination pathway without requiring direct physical contact or mechanical intervention.
2Reliability
If fluid barrier system is added to prevent contamination, then reliability is improved, but device complexity increases
Solution Approach 1:
The system uses pneumatic principles by injecting inert gas fluid through nozzles to create a pressure-based barrier. This approach leverages fluid dynamics rather than mechanical moving parts, simplifying the overall system structure while maintaining effective contamination prevention through pressure differentials and fluid flow patterns.
Solution Approach 2:
The system introduces an inert gas atmosphere as a protective barrier. This inert fluid environment prevents chemical reactions and contamination without requiring complex mechanical sealing or isolation mechanisms, thereby reducing device complexity while maintaining reliability.
3Object-affected harmful factors
If multiple nozzles are used to create fluid barrier, then contamination prevention is improved, but device complexity increases
Solution Approach 1:
The contamination protection function is segmented into multiple nozzles distributed along the vacuum pathway. Each nozzle contributes to the overall fluid barrier, and their collective action provides comprehensive coverage. This segmentation allows the system to address contamination from multiple potential sources simultaneously without requiring a single complex mechanism.
Solution Approach 2:
The nozzle array serves multiple functions: it generates the fluid barrier, distributes the inert gas evenly, and can be activated selectively based on detected contamination risks. This multi-functionality reduces the need for separate systems for each function, thereby managing complexity while improving contamination prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluid barrier effectively prevents contamination and maintains the integrity of the semiconductor wafers by ensuring consistent pressure and temperature conditions, reducing the risk of wafer damage and improving the uniformity of semiconductor processes.
Implementation Method 1
A semiconductor processing system with a nozzle array that generates a fluid barrier in the outflow channel to prevent backflow of particles and fluids into the chamber
Data Source
AI summary
A semiconductor process system includes a semiconductor process chamber having an interior volume. A pump extracts gases from the semiconductor process chamber via an outlet channel communicably coupled to the semiconductor process chamber. The system includes a plurality of fluid nozzles configured to prevent the backflow of particles from the outlet channel to interior volume by generating a fluid barrier within the outlet channel responsive to the pump ceasing to function.


