Overdrive I/O ESD Network With Multi-Rail Clamp Paths

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Solution Overview

Problem

Existing ESD protection circuits in electronic devices allow ESD current to flow through critical components, potentially causing damage and requiring costly repairs, especially when operating at overdrive voltages.

Innovation Solution

Implementing ESD protection circuits with multiple power clamp circuits and diode strings that divert ESD current away from logic circuits, maintaining voltage differences and providing alternative paths to prevent damage during ESD events.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ESD protection circuits are implemented in electronic devices operating at overdrive voltages, then critical components are protected from ESD damage, but ESD current can still flow through the protection circuit components causing potential damage and requiring costly repairs

Engineering Contradiction:
Improveprotection effectivenessVSAvoidESD current magnitude
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The ESD protection circuit is divided into multiple parallel clamp circuits (first power clamp circuit, second power clamp circuit, third power clamp circuit) each handling different voltage ranges. This segmentation distributes the ESD current across multiple paths rather than concentrating it through a single protection path, reducing the current magnitude through each individual component.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Diode strings are introduced as intermediary components between the clamp circuits and the I/O interface. These diode strings act as current-limiting elements that divert and control the ESD current flow, preventing excessive current from reaching critical components while still providing effective ESD protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If multiple power clamp circuits and diode strings are added to divert ESD current, then ESD current magnitude is reduced and critical components are protected, but device complexity increases

Engineering Contradiction:
ImproveESD current magnitudeVSAvoidcircuit complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The multiple clamp circuits serve dual purposes: they provide ESD protection while also maintaining proper voltage levels during normal overdrive operation. Each clamp circuit is designed to activate at specific voltage thresholds, ensuring that the I/O interface remains at the correct overdrive voltage during normal operation while providing staged protection during ESD events.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The protection circuit utilizes different clamp voltage parameters for different clamp circuits. The first power clamp circuit clamps at a first voltage, the second power clamp circuit clamps at a second voltage, and the third power clamp circuit clamps at a third voltage. This parameter differentiation allows the circuits to handle ESD events at various voltage levels efficiently without requiring excessive complexity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces ESD current magnitude and protects critical components by diverting current through alternative paths, enhancing the reliability and robustness of electronic devices operating at overdrive voltages.

Implementation Method 1

a first power clamp circuit having a first end coupled to the supply voltage rail and a second end coupled to the post driver voltage rail

Methodology Applied
Scientific EffectVoltage clamping:

Implementation Method 2

a first power-to-power clamp circuit having a first end coupled to the low-side logic-high voltage rail and a second end coupled to the post driver voltage rail, configured to receive ESD current between the post driver voltage rail and the low-side logic-high voltage rail

Methodology Applied
Scientific EffectVoltage clamping:

Implementation Method 3

a second power-to-power clamp circuit having a first end coupled to the high-side logic-low voltage rail and a second end coupled to the post driver voltage rail, configured to receive ESD current between the post driver voltage rail and the high-side logic-low voltage rail

Methodology Applied
Scientific EffectVoltage clamping:

Implementation Method 4

ESD protection circuits with multiple power clamp circuits and diode strings that divert ESD current away from logic circuits

Methodology Applied
Scientific EffectDiode conduction: Diode

Data Source

PatentUS20250240005A1Overdrive I/O ESD Protection Network
Publication Date: 2025.07.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250240005A1 patent drawing
  • US20250240005A1 patent drawing
  • US20250240005A1 patent drawing

AI summary

Systems and methods are provided for an electronic device that comprises a core logic circuit coupled to a supply voltage rail and an operating voltage rail. During a standard operation, the supply voltage rail has a supply voltage, the operating voltage rail has an operating voltage, and a post driver voltage rail has an overdrive voltage that is greater than the operating voltage. The electronic device further comprises a first power clamp circuit coupled to the supply voltage rail and the post driver voltage rail, a low-side logic-high voltage rail coupled to the first end of the core logic circuit, and a first power-to-power clamp circuit coupled to the low-side logic-high voltage rail and the post driver voltage rail. The first power-to-power clamp circuit is configured to receive electrostatic discharge (ESD) current between the post driver voltage rail and the low-side logic-high voltage rail.