Overhang Die Stacking With Direct Substrate Interconnects
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Solution Overview
Problem
There is a need for packages with integrated devices that offer improved performance and reduced size, as existing packages face challenges in efficiently coupling integrated devices to substrates while minimizing space and enhancing electrical pathways.
Innovation Solution
The package design includes a substrate with a first integrated device coupled to it, and a second integrated device coupled to the first device such that a portion of the second device overhangs. This configuration allows the second device to be directly coupled to the substrate through pillar interconnects, solder interconnects, or an interposer, bypassing the use of wire bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonds are used to connect integrated devices to substrate, then electrical connections can be established, but package size increases and signal speed decreases
Solution Approach 1:
The patent extracts and eliminates the wire bond component from the package structure. By directly coupling the second integrated device to the substrate through pillar interconnects, the wire bonds are removed entirely, reducing package volume and eliminating the associated signal path delays.
Solution Approach 2:
The patent transitions from a planar wire bond connection to a vertical pillar interconnect structure. The pillar interconnects extend vertically from the substrate through the first integrated device to the second integrated device, utilizing the third dimension (height) to create shorter electrical pathways and reduce package footprint.
2Reliability
If wire bonds are used for interconnection, then electrical connections are established, but interconnect length increases reducing performance
Solution Approach 1:
The wire bonds are extracted and removed from the package structure. The electrical connection path is reconfigured to use pillar interconnects that are directly integrated into the substrate, eliminating the need for external wire bonds and reducing total interconnect length.
Solution Approach 2:
The pillar interconnects serve as intermediary structures that provide direct electrical pathways between the substrate and the second integrated device. These pillars are formed as integral parts of the substrate structure, mediating the electrical connection without requiring separate wire bond components.
3Area of stationary object
If integrated devices are stacked vertically, then package footprint is reduced, but coupling complexity increases
Solution Approach 1:
The patent merges the substrate structure with the interconnect structure by forming pillar interconnects directly within the substrate. This integration eliminates the need for separate coupling components and simplifies the overall structure despite the vertical stacking configuration.
Solution Approach 2:
The patent utilizes vertical stacking in the third dimension to reduce the horizontal package footprint. By arranging integrated devices in layers above the substrate and using vertical pillar interconnects, the design trades increased vertical complexity for reduced planar area.
Data Source
AI summary
A package that includes a substrate, a first integrated device coupled to the substrate, and a second integrated device coupled to the first integrated device. A portion of the second integrated device overhangs over the first integrated device. The second integrated device is configured to be coupled to the substrate. The second integrated device includes a front side and a back side. The front side of the second integrated device faces the substrate.