Overhanging Frame Ring Stack for Semiconductor Stress and Warpage
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic systems faces challenges in controlling warpage and mechanical stress, leading to issues like delamination and cracking, which affect the yield and reliability of semiconductor devices.
Innovation Solution
The use of frame rings with overhangs disposed on circuit substrates to encircle semiconductor packages, which helps in controlling warpage and reducing mechanical stress without incurring an excessive area penalty, thereby enhancing the mechanical stability and reliability of the semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in miniaturized electronic systems, then device functionality and integration density are improved, but warpage and mechanical stress increase leading to delamination and cracking
Solution Approach 1:
The frame ring is segmented into multiple layers (first frame ring, second frame ring, third frame ring) that are stacked and bonded together. Each layer provides structural support and stress distribution, with the segmentation allowing the frame to better accommodate warpage while maintaining overall structural integrity and enclosing the semiconductor devices
Solution Approach 2:
The frame ring structure combines multiple materials with different properties - the substrate, frame rings, and semiconductor devices are made of different materials with varying coefficients of thermal expansion and mechanical properties. This composite structure distributes mechanical stress and reduces warpage effects across the integrated system
2Reliability
If frame rings are added to control warpage and reduce mechanical stress, then reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The frame ring structure serves multiple functions simultaneously: it provides mechanical support, distributes stress, controls warpage, and encloses the semiconductor devices. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity while achieving improved reliability
3Stability of the object's composition
If frame rings with overhangs are used to control warpage, then warpage is reduced by up to 5%, but manufacturing precision requirements increase
Solution Approach 1:
The frame rings are designed with pre-calculated dimensions and overhang configurations that proactively compensate for expected warpage during subsequent manufacturing and operation. The preliminary design of the frame ring geometry (including overhang distances and layer thicknesses) anticipates and counteracts warpage forces before they fully develop, reducing the need for post-manufacturing adjustments
Data Source
AI summary
A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.