Overhanging Top Capacitor Plate Moisture Barrier
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Solution Overview
Problem
Moisture intrusion between the top and bottom metal plates of capacitors in electronic devices leads to performance degradation and failure, particularly in non-hermetic packages exposed to humid environments, due to high operating voltage and poor adhesion between metal and protective overcoat.
Innovation Solution
An integrated capacitor design with an overhanging top capacitor plate that forms an encapsulating structure, using dielectric layers and a conductive substrate via to create a barrier against moisture, along with additional dielectric and metal layers for enhanced protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional capacitor structure with flat top and bottom plates is used, then the manufacturing process is simple, but moisture can penetrate between the plates causing performance degradation and failure
Solution Approach 1:
The top capacitor plate is designed to overhang the bottom capacitor plate in the lateral dimension, creating an encapsulating structure that prevents moisture penetration. This dimensional change from flat co-planar plates to overhanging three-dimensional structure provides moisture barrier functionality without requiring additional protective layers or complex packaging.
Solution Approach 2:
The overhanging top capacitor plate acts as a structural barrier similar to a protective shell, physically blocking moisture pathways between the capacitor plates. This structural approach replaces the need for separate protective overcoats or hermetic packaging while maintaining electrical functionality.
2Power
If high operating voltage is used to improve capacitor performance, then the capacitor capacity and efficiency increase, but the likelihood of moisture-related failures increases due to electrical stress on protective overcoats
Solution Approach 1:
The protective encapsulation function is extracted from a separate protective overcoat layer and integrated directly into the top capacitor plate structure itself. This eliminates the metal-overcoat interface that would be susceptible to high voltage stress and adhesion failure, while maintaining the protective barrier function.
Solution Approach 2:
The electrical conductor function and the protective barrier function are merged into a single integrated structure - the overhanging top capacitor plate. This dual-function design eliminates the need for separate protective layers that could fail under high voltage conditions.
3Ease of manufacture
If non-hermetic packaging is used to reduce cost and complexity, then manufacturing cost and device simplicity improve, but the capacitor becomes susceptible to moisture intrusion from humid environments
Solution Approach 1:
The top capacitor plate is designed to serve multiple functions simultaneously: electrical conduction, capacitance formation, and moisture barrier protection. This multi-functionality allows non-hermetic packaging to be used while still protecting against moisture intrusion, reducing overall packaging requirements and cost.
Solution Approach 2:
The capacitor structure itself provides the moisture protection function through its overhanging geometry, without requiring external hermetic packaging. The structure is self-protecting, eliminating the need for additional protective packaging layers or complex sealing mechanisms.
Data Source
AI summary
Embodiments include but are not limited to apparatuses and systems including an integrated capacitor. An integrated capacitor may include a substrate, a first capacitor plate having four edges, and a second capacitor plate overhanging the four edges of the first capacitor plate and disposed over the first capacitor plate such that the first capacitor plate is disposed between the second capacitor plate and the substrate.