Overhanging Connection Stack for IC Package Reliability
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Solution Overview
Problem
The increasing demand for smaller, more functional integrated circuits with higher I/O density poses challenges in manufacturing, including unreliable fine pitch connections and mounting issues, which affect the reliability and cost-effectiveness of integrated circuit packages.
Innovation Solution
An integrated circuit package system is designed with overhanging connection stacks that provide a staggered configuration over conductive lines, ensuring reliable connections and increased density without shorting, and are encapsulated with an epoxy molding compound for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed on a flat bond finger or trace surface, then the bonding process is simple, but the connection reliability is poor and shorting with adjacent lead fingers occurs
Solution Approach 1:
The bonding structure transitions from a two-dimensional flat bond finger surface to a three-dimensional protruding structure that extends vertically from the substrate. This dimensional change allows the bond finger to protrude above the plane of adjacent lead fingers, eliminating shorting while maintaining reliable electrical connection.
2Quantity of substance
If I/O pitch is reduced to increase density, then more I/O connections are achieved in smaller space, but manufacturing problems and connection reliability deteriorate
Solution Approach 1:
By extending bond fingers vertically from the substrate plane, the design utilizes the third dimension to increase I/O density without compromising horizontal pitch. This allows multiple I/O connections in compact spaces while maintaining adequate spacing between adjacent connections to prevent shorting.
Solution Approach 2:
The bonding structure is segmented into discrete protruding bond fingers that are spatially separated from each other. Each bond finger operates as an independent connection element, allowing precise control over connection reliability and enabling high-density packaging without compromising individual connection integrity.
3Quantity of substance
If bond finger width is reduced for fine pitch connections, then I/O density increases, but bonding reliability and resistance to shorting decrease
Solution Approach 1:
The solution moves the bonding interaction from a horizontal plane to a vertical dimension. Bond fingers protrude upward from the substrate, creating height differential that physically prevents contact between adjacent bond fingers and lead fingers, thereby eliminating shorting risk while maintaining fine pitch horizontal spacing for high density.
Data Source
AI summary
An integrated circuit package system comprising: providing a first conductive line adjacent to a second conductive line; forming a first connection stack over the first conductive line with the first connection stack overhanging the second conductive line; connecting an integrated circuit device and the first connection stack; and encapsulating the integrated circuit device and the first connection stack.