Semiconductor Terminal Layout for Heat Spreading Without Larger Footprint
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices face challenges in enhancing heat radiation properties without increasing the device size, particularly in in-vehicle semiconductor devices that require high reliability.
Innovation Solution
The semiconductor device design includes a base material, a semiconductor chip, main and signal electrodes, terminals, and a metal wire connection. The signal terminal overhangs the base material while being separated from it, allowing for increased heat radiation without expanding the device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat spreader area is increased to improve heat radiation properties, then heat radiation efficiency is improved, but the device size increases
Solution Approach 1:
The signal terminal is configured to overhang the base material in a lateral direction, utilizing three-dimensional spatial arrangement instead of planar expansion. This allows the heat spreader to extend laterally for improved heat radiation while the signal terminal positioned above prevents interference, effectively resolving the contradiction between heat radiation area and device footprint by transitioning from two-dimensional to three-dimensional space utilization.
2Temperature
If the base material extends in the lateral direction to increase heat radiation area, then heat radiation properties are improved, but the signal terminal may be interfered with
Solution Approach 1:
The signal terminal is positioned to overhang the base material in the lateral direction, creating vertical separation between the extended base material and the signal terminal. This three-dimensional configuration allows the base material to extend laterally for enhanced heat radiation without interfering with the signal terminal, as the terminal is supported by the bonding pad and positioned above the base material surface.
Solution Approach 2:
The bonding pad serves as an intermediary element that supports the signal terminal and enables its overhanging configuration. By providing a bonding interface between the signal terminal and the semiconductor chip, the bonding pad allows the signal terminal to be positioned in a location that optimizes heat radiation while maintaining electrical connection and preventing interference with the extended base material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat radiation properties by allowing the heat spreader to extend laterally without interfering with the signal terminal, thus preventing size increases and minimizing the risk of metal wire deformation and associated defects.
Implementation Method 1
The signal terminal is connected to the signal electrode via a metal wire
Implementation Method 2
heat generated by power conduction of the semiconductor chip is diffused in a lateral direction mainly by a heat spreader
Data Source
AI summary
An object of the present disclosure is to increase heat radiation properties of a semiconductor device without increasing a size of the semiconductor device. A semiconductor device includes: a base material; a semiconductor chip mounted to an upper surface of the base material; a main electrode and a signal electrode formed in regions different from each other on the semiconductor chip, respectively; a main terminal bonded to the main electrode; and a signal terminal connected to the signal electrode via a metal wire, wherein a region in the signal terminal to which the metal wire is bonded overhangs the base material while being separated from the base material.