Overhead Buffer Device for FOUP Storage
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently transporting and buffering 12-inch wafers due to their weight, requiring automated material handling systems and limited buffer regions, which increases production cycle time and reduces space utilization.
Innovation Solution
An overhead buffer device and wafer transport system with a strut module and buffer modules installed on a semi-conductor factory's top wall, featuring adjustable overhead struts and buffer modules with sensors, allowing for efficient transportation and buffering of FOUPs between processing tools and load ports, optimizing space use and reducing production cycle time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a buffer region is equipped to receive FOUPs at each processing tool, then the FOUP receiving number increases, but the production cycle time increases due to limited buffer capacity and space
Solution Approach 1:
The patent transitions from traditional ground-level buffer regions to an overhead buffer system suspended from the ceiling. By utilizing the vertical dimension and overhead space, the system increases FOUP storage capacity without occupying additional floor space, thereby allowing more FOUPs to be buffered simultaneously while maintaining efficient retrieval times
Solution Approach 2:
The overhead buffer system is divided into multiple independent buffer modules, each capable of holding FOUPs. These modular units can be distributed across different overhead locations, allowing parallel buffering operations and reducing the time required to retrieve specific FOUPs by selecting from multiple distributed buffer locations
2Productivity
If traditional ground-level buffer regions are used, then the system structure is simple, but the space utilization is insufficient and production efficiency is reduced
Solution Approach 1:
The system exploits the underutilized overhead space above the factory floor by suspending buffer modules from the ceiling structure. This vertical space utilization approach dramatically increases the effective buffering capacity within the same facility footprint, improving transportation efficiency without requiring additional horizontal space
Solution Approach 2:
The overhead buffer system incorporates movable and adjustable components that allow dynamic reconfiguration of buffer locations and capacities. This flexibility enables the system to adapt to changing production requirements, optimizing space utilization and transportation efficiency according to real-time needs
Data Source
AI summary
An overhead buffer device used for disposing in a semi-conductor factory includes a strut module and a plurality of buffer modules. The strut module disposed on the top wall of the factory has a horizontal beam and a plurality of overhead strut. The overhead strut is set on the horizontal beam and spaced arranged along the horizontal beam. The buffer modules are installed on the overhead strut respectively. Each buffer module has a plurality of buffers arranged in sequence and along a vertical direction. Each buffer is used for receiving one front opening unified pod (FOUP). Thus, the instant disclosure can be used for using the space of the factory efficiently. Besides, the instant disclosure also provides a wafer transport system having the overhead buffer device.