Overhead Modular Cooling Structure for High-Density Server Racks

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Solution Overview

Problem

Data centers face challenges in cooling high-density servers due to limitations in existing cooling systems, which struggle to scale with increasing heat loads, leading to space inefficiencies and difficulties in upgrading to meet energy efficiency regulations.

Innovation Solution

A modular server rack cooling structure that includes rotatably coupled heat exchangers supported by beam members, allowing for flexible placement and increased cooling capacity without attaching to the server racks, and a method for installing these structures to form hot and cold aisles for efficient fluid flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If rear-door heat exchangers are used to cool server racks, then cooling capacity is provided to the servers, but the cooling capacity is limited by the physical size of the rack exterior perimeter and fluid flow constraints

Engineering Contradiction:
Improvecooling capacityVSAvoidscalability to high-density servers
Core Design Contradiction:
PowerVSAdaptability or versatility

Solution Approach 1:

The patent transitions from two-dimensional rear-door heat exchangers attached to the rack perimeter to three-dimensional overhead cooling structures that extend above the server racks. This dimensional change allows for significantly increased cooling capacity by providing thermal exchange surfaces from multiple directions (top, sides, and rear) rather than being constrained to the limited rear perimeter area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling system is divided into modular overhead components that can be independently configured and installed. The heat exchanger structure is segmented into multiple sections (front, rear, side walls) that can be assembled in different configurations to match varying server density requirements, enabling scalability without being constrained by a fixed rack-mounted design.

Inventive Principle:
Principle #1Segmentation

2Power

If in-row rack cooling systems with integral hot and cold aisle containment are constructed, then cooling is provided to server racks, but significant space is wasted and upgrading cooling capacity becomes difficult

Engineering Contradiction:
Improvecooling capacityVSAvoidfloor space efficiency
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The cooling infrastructure is moved from the floor level (in-row rack cooling) to the overhead space above the racks. This vertical dimension utilization eliminates the need for floor-level cooling units and associated aisle containment structures, thereby maximizing floor space availability for server placement while maintaining effective cooling capacity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The overhead cooling structure serves multiple functions: it provides cooling to multiple racks simultaneously, acts as a structural support for thermal exchange surfaces, and enables flexible configuration adjustments. This multi-functionality replaces the need for dedicated in-row cooling units and aisle containment, improving space efficiency while maintaining cooling performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Power

If overhead rack coolers using R-134a refrigerant are used, then up to 20 kW of cooling output is achieved, but the total capacity is limited by the physical size of the coils and enclosure

Engineering Contradiction:
Improvecooling outputVSAvoidenclosure size constraints
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The cooling system is divided into separate functional modules: overhead heat exchanger structures, fluid distribution manifolds, and coil assemblies. This segmentation allows each component to be optimized independently, enabling increased total cooling capacity without proportionally increasing the enclosure volume, as the modular components can be efficiently packed and configured.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes the vertical space above server racks to deploy extended heat exchanger surfaces and fluid distribution networks. By operating in the three-dimensional overhead volume rather than being constrained to a two-dimensional enclosure footprint, the system achieves higher cooling output without a proportional increase in enclosed space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances cooling capacity within the same floor space, reduces the cooling footprint, and allows for retrofits or new installations, improving energy efficiency and scalability to meet growing heat loads while adhering to energy regulations.

Implementation Method 1

The first supporting member is configured to position the first heat exchanger in heat transfer relationship with the server

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS9839163B2Modular IT rack cooling assemblies and methods for assembling same
Publication Date: 2017.12.05 INERTECH IP LLC
  • US9839163B2 patent drawing
  • US9839163B2 patent drawing
  • US9839163B2 patent drawing

AI summary

A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.