Overlapping Coil Inductor Layout for Longer Wireless Communication

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Solution Overview

Problem

Existing semiconductor devices with inductors for contactless wireless communication face challenges in maintaining effective communication distance due to high wiring parasitic resistance, which limits the instantaneous current flow and induced electromotive force.

Innovation Solution

The semiconductor device incorporates a configuration of multiple coil wirings with overlapping regions and a drive unit that supplies a common signal to each coil, utilizing timing adjustment circuits to synchronize signal input, thereby reducing wiring parasitic resistance and increasing the instantaneous current flow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single coil wiring is used for contactless wireless communication, then the device structure is simple, but the wiring parasitic resistance is high which limits instantaneous current flow and induced electromotive force

Engineering Contradiction:

Improvecoil structureVSAvoidinstantaneous current flow

Core Design Contradiction:

Device complexityVSPower

Solution Approach 1:

The single coil wiring is divided into multiple coil wirings (first coil wiring, second coil wiring, third coil wiring, fourth coil wiring) that are arranged in parallel. Each coil wiring has its own drive circuit, which divides the total wiring parasitic resistance into smaller segments. This segmentation reduces the overall parasitic resistance and enables higher instantaneous current flow while maintaining a relatively simple overall structure.

Inventive Principle:

Principle #1Segmentation

2Power

If multiple coil wirings are used to reduce wiring parasitic resistance, then the instantaneous current flow increases, but the device complexity increases

Engineering Contradiction:

Improveinstantaneous current flowVSAvoidcoil structure

Core Design Contradiction:

PowerVSDevice complexity

Solution Approach 1:

Multiple coil wirings are merged into a unified inductor structure where all coils are driven by a common signal source. The drive circuits of multiple coils are synchronized to operate simultaneously, creating a combined magnetic field that enhances the induced electromotive force. This merging approach achieves high instantaneous current flow while keeping the control structure relatively simple through common signal distribution.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The coil wirings are arranged in different spatial dimensions and orientations (e.g., orthogonal arrangements, overlapping regions) to create a three-dimensional magnetic field structure. This dimensional arrangement allows multiple coils to contribute to the same magnetic coupling function without requiring excessive planar space, thus reducing overall device complexity while maintaining high power output.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Power

If multiple coil wirings with overlapping regions are used, then the induced electromotive force and communication distance are enhanced, but the device area increases

Engineering Contradiction:

Improveinduced electromotive forceVSAvoiddevice area

Core Design Contradiction:

PowerVSArea of stationary object

Solution Approach 1:

The multiple coil wirings are arranged with overlapping regions where coils are nested or interlaced in space. The first, second, third, and fourth coil wirings are positioned such that their magnetic fields overlap and reinforce each other, creating enhanced induced electromotive force within a compact footprint. This nesting arrangement allows multiple coils to share spatial volume rather than requiring separate planar areas.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Coil wirings are arranged in three-dimensional space with vertical and horizontal components, utilizing multiple layers and orientations. This dimensional arrangement allows the magnetic fields to overlap and interact more effectively without requiring proportional increases in planar device area, thus enhancing induced electromotive force while controlling overall device footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the induced electromotive force and communication distance, improving contactless wireless communication efficiency by dividing the wiring parasitic resistance and ensuring synchronized current flow across the coil wirings.

Implementation Method 1

contactless wireless communication by magnetic coupling

Methodology Applied

Scientific EffectMagnetic coupling: Electromagnetic Induction

Implementation Method 2

drive circuit that supplies a common signal to the first coil wiring and the second coil wiring

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20250301772A1Semiconductor device and semiconductor substrate including semiconductor device

Publication Date: 2025.09.25 KIOXIA CORP

AI summary

A semiconductor device includes a first inductor including a first coil wiring located on a first plane, a second coil wiring of which at least a part is located on the first plane, and a drive circuit that supplies a common signal to the first coil wiring and the second coil wiring. A first region surrounded by the first coil wiring and a second region surrounded by the second coil wiring overlap each other in a direction that is perpendicular to the first plane.