Overlapping Conductive Lines in Display Apparatus

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Solution Overview

Problem

Display apparatuses are prone to short circuits between conductive lines due to external impacts, leading to defects in the image displayed, as existing encapsulation methods fail to adequately protect the internal wiring.

Innovation Solution

The design incorporates a substrate with conductive lines and connection lines, where a passivation layer and insulation layer with openings are used to reduce the overlapping area between conductive lines, and a second conductive line with holes aligns with the openings in the insulation layer, minimizing the risk of short circuits by decreasing the contact area between the conductive lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conductive lines are positioned close to each other to reduce device area, then device area is reduced, but the risk of short circuits due to external impact increases

Engineering Contradiction:
Improvedevice areaVSAvoidshort circuit risk
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent introduces a vertical stacking dimension by positioning conductive lines at different heights (first conductive line on first interlayer insulation layer, second conductive line on second interlayer insulation layer), allowing them to overlap in the plan view while being separated in the vertical direction, thus reducing the device area without increasing short circuit risk

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent uses insulating layers (first interlayer insulation layer, second interlayer insulation layer, and encapsulation layer) as intermediaries between conductive lines to prevent direct contact and short circuits, while still allowing them to be positioned close together or overlap in the plan view

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If encapsulation is added to protect conductive lines from external impact, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveshort circuit resistanceVSAvoidencapsulation structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses thin film encapsulation layers (encapsulation layer extending over the conductive lines) to protect the conductive lines from external impact, providing reliable protection while maintaining a relatively simple and compact structure without bulky encapsulation components

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS10381592B2Display apparatus including overlapping conductive lines
Publication Date: 2019.08.13 SAMSUNG DISPLAY CO LTD
  • US10381592B2 patent drawing
  • US10381592B2 patent drawing
  • US10381592B2 patent drawing

AI summary

A first conductive line is positioned outside a display area of a substrate. A passivation layer covers a portion of the first conductive line. A first connection line is positioned on the passivation layer, contacting the first conductive line. An insulation layer having at least one opening is positioned on the passivation layer and the first connection line. A second connection line is positioned on the insulation layer. The second connection line contacts the first connection line via the at least one opening and has an end portion that contacts the first conductive line. A second conductive line is positioned between the display area and the first conductive line, overlapping the first connection line and including a hole. The hole of the second conductive line overlaps one of the at least one opening. The passivation layer is interposed between the second conductive line and the first connection line.