Overlapping Connection Circuit Board Minimizes Display Dead Space
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Solution Overview
Problem
Existing display apparatuses face challenges in minimizing dead space while maintaining high-quality image performance, particularly due to the limitations of conventional connection methods between display panels and circuit boards.
Innovation Solution
A display apparatus design that includes a display panel, a main circuit board overlapping the display panel, and a connection circuit board with conductive layers and insulating films, allowing for overlapping pad units connected by anisotropic conductive films to reduce dead space and simplify the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a conventional connection method is used between display panel and circuit board, then the manufacturing process is simple, but dead space increases and display area is reduced
Solution Approach 1:
The connection circuit board is configured to overlap with the display panel in the plan view, transitioning from a conventional side-by-side connection to a multi-layer stacked arrangement. This dimensional reconfiguration allows the connection structure to occupy vertical space rather than horizontal space, thereby minimizing dead space and maximizing the display area.
Solution Approach 2:
The connection circuit board is positioned between the display panel and the main circuit board, creating a nested multi-layer structure. The pad units on the connection circuit board are arranged to overlap with pad units on both the display panel and main circuit board, forming a compact nested configuration that reduces overall device footprint while maintaining all necessary electrical connections.
2Reliability
If tolerance intervals are increased to ensure proper connection, then connection reliability improves, but dead space increases
Solution Approach 1:
The connection circuit board serves as an intermediary component between the display panel and main circuit board. Its pad units are electrically connected to both the display pad units and main pad units through anisotropic conductive films, providing a buffered connection interface that ensures reliable signal transmission while allowing for precise overlapping alignment that minimizes tolerance intervals and dead space.
3Area of stationary object
If pad units are arranged to overlap in plan view, then dead space is minimized, but manufacturing precision requirements increase
Solution Approach 1:
The electrical connection function is extracted from a direct rigid connection and implemented through anisotropic conductive films between overlapping pad units. This extraction allows for a degree of positional flexibility in the overlapping pad units, as the compliant conductive film can accommodate minor alignment variations, thereby reducing the stringent manufacturing precision requirements that would otherwise be necessary for direct rigid connections.
4Reliability
If connection circuit board is arranged between display panel and main circuit board, then signal transmission quality improves, but device complexity increases
Solution Approach 1:
The connection circuit board performs multiple functions simultaneously: it provides electrical connections between the display panel and main circuit board, serves as a structural support element, enables the overlapping multi-layer configuration, and facilitates signal transmission through its conductive layers. This multi-functionality justifies the additional component while delivering comprehensive benefits that outweigh the increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively minimizes dead space and enhances image quality by allowing for a more efficient and simplified connection process between the display panel and circuit boards, reducing the need for tolerance intervals and improving signal transmission.
Implementation Method 1
connected to the display pad unit and the main pad unit, respectively, by an anisotropic conductive film
Data Source
AI summary
A display apparatus includes: a display panel including a plurality of pixels, a main circuit board configured to transmit a signal to the display panel, and a connection circuit board arranged between the display panel and the main circuit board and having a lower surface to which one of the display panel and the main circuit board is attached and an upper surface to which another one of the display panel and the main circuit board is attached.