Overlapping Deposition Chamber Layout for Compact Vacuum Transport
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Solution Overview
Problem
Existing deposition apparatuses are inefficient in terms of space utilization due to the separate and distinct configurations of processor and transfer chambers, limiting overall efficiency.
Innovation Solution
The processor chamber and transfer chamber partially overlap, with a movable substrate holder and buffer modules, allowing for efficient substrate transport and deposition material application while maintaining a vacuum state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the processor chamber and transfer chamber are configured separately and distinctly, then the structural simplicity and ease of manufacture are improved, but the space utilization efficiency deteriorates
Solution Approach 1:
The processor chamber and transfer chamber are merged in a partial region where they overlap with each other. The processor chamber is positioned beneath the transfer chamber in this overlapping region, allowing both chambers to share the same spatial footprint partially, thereby improving space utilization without compromising structural simplicity
Solution Approach 2:
The chambers are arranged in different vertical levels rather than purely horizontal adjacency. The processor chamber is disposed under the transfer chamber in the overlapping region, utilizing the vertical dimension to achieve compact space arrangement while maintaining separate functional zones
2Area of stationary object
If the chamber length is reduced through overlapping configuration, then the space efficiency is improved, but the device complexity increases
Solution Approach 1:
The overlapping region is defined as a specific segment of the processor chamber, divided into first, second, and third regions. This segmentation allows precise control over where the chambers overlap and where they remain separate, managing complexity through structured zonal definition rather than uniform integration
Solution Approach 2:
The processor chamber is nested beneath the transfer chamber in the overlapping region, with the substrate holder positioned within the processor chamber's internal space. This nested arrangement allows compact integration while maintaining independent access and control of each chamber through defined boundaries and gates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall chamber length, enhancing space and manufacturing cost efficiency by allowing continuous deposition processes without interrupting the vacuum state.
Implementation Method 1
the organic thin film is deposited on a substrate, using a vacuum thermal deposition method
Data Source
AI summary
A deposition apparatus and a method of driving the same are disclosed. A deposition apparatus includes a processor chamber configured to deposit a deposition material on a substrate, and a transfer chamber configured to transport the substrate to the processor chamber. In a partial region of the processor chamber, the processor chamber and the transfer chamber overlap with each other.