Overlapping Flip-Flop Cell Layout for Semiconductor Integration
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Solution Overview
Problem
There is a need for semiconductor devices with improved electric characteristics and increased integration density to meet the demands of the electronic industry for high-reliability and multifunctional devices.
Innovation Solution
A semiconductor device is designed with a flip-flop cell that includes a scan MUX circuit, master latch circuit, slave latch circuit, clock driver circuit, and output circuit, each comprising multiple active devices that occupy specific, overlapping areas on a semiconductor substrate, enhancing integration density and electric characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If circuits are arranged in separate non-overlapping areas, then ease of manufacture is improved, but integration density deteriorates
Solution Approach 1:
The patent transitions from traditional planar non-overlapping circuit arrangement to a three-dimensional overlapping layout where circuits are positioned in different vertical layers. The scan MUX circuit is placed in a first well region while the clock driver circuit is placed in a second well region that overlaps with the first well region in plan view, enabling vertical stacking and improved integration density without compromising manufacturability.
Solution Approach 2:
The patent implements nested arrangement where the clock driver circuit is positioned within the overlapping region of the scan MUX circuit's well region. This nesting allows the clock driver circuit to be embedded in the vertical space above or below the scan MUX circuit, maximizing space utilization and achieving higher integration density while maintaining clear manufacturing boundaries through well region separation.
2Productivity
If integration density is increased through overlapping areas, then productivity is improved, but device complexity increases
Solution Approach 1:
The patent divides the overlapping region into distinct well regions - a first well region for the scan MUX circuit and a second well region for the clock driver circuit. This segmentation allows each circuit to be independently designed, manufactured, and tested within its own well region, reducing overall device complexity despite the three-dimensional overlapping arrangement that improves integration density.
Data Source
AI summary
A semiconductor device includes a flip flop cell. The flip flop cell is formed on a semiconductor substrate, includes a flip flop circuit, and comprises a scan mux circuit, a master latch circuit, a slave latch circuit, a clock driver circuit, and an output circuit. Each of the scan mux circuit, the master latch circuit, the slave latch circuit, the clock driver circuit, and the output circuit includes a plurality of active devices which together output a resulting signal for that circuit based on inputs, is a sub-circuit of the flip flop circuit, and occupies a continuously-bounded area of the flip flop circuit from a plan view. At least a first sub-circuit and a second sub-circuit of the sub-circuits overlap from the plan view in a first overlap region, the first overlap region including part of a first continuously-bounded area for the first sub-circuit and part of a second continuously-bounded area for the second sub-circuit.