Overlapping Implant Masks for Uniform Voltage Thresholds

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Solution Overview

Problem

As semiconductor arrangements become smaller, implant regions defined by masks do not adequately cover portions of devices, resulting in undesirable variations in voltage thresholds among devices.

Innovation Solution

The use of multiple overlapping implant masks to define implant regions, allowing for improved coverage and uniform voltage thresholds by applying different doping concentrations through each mask, ensuring more precise doping and reduced variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single implant mask is used to define implant regions, then the manufacturing process is simple, but the doping coverage is insufficient and voltage threshold variations occur

Engineering Contradiction:
Improvedoping coverageVSAvoidmask design
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The implant mask is divided into multiple separate masks (first implant mask and second implant mask), each defining different implant regions. This segmentation allows each mask to be optimized for specific doping requirements, ensuring complete coverage of all active regions while maintaining manufacturing precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution transitions from a single two-dimensional mask to multiple two-dimensional masks that overlap in space. By using multiple masks with different patterns and overlapping regions, the system achieves complete coverage that cannot be obtained with a single mask, effectively adding a temporal dimension to the masking process.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If multiple overlapping implant masks are used to improve doping coverage, then voltage threshold uniformity is improved, but the device complexity increases

Engineering Contradiction:
Improvevoltage threshold uniformityVSAvoidmask design
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Different regions of the semiconductor device receive different doping concentrations through the use of multiple masks. The first implant mask and second implant mask are designed to apply doping selectively to different active regions, ensuring that each region receives the appropriate doping level for optimal voltage threshold uniformity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The multiple implant masks are merged in the sense that they are combined to achieve a comprehensive doping pattern. The first implant mask and second implant mask work together, with their overlapping regions providing the necessary doping coverage to ensure uniform voltage thresholds across all active regions.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach achieves more uniform and stable voltage thresholds, improved doping coverage, and cost-effective mask design by ensuring that all active regions receive the intended doping concentrations, reducing variations and enhancing semiconductor performance.

Implementation Method 1

A first implant mask is applied to a semiconductor arrangement. The first implant mask defines a first implant region. A second implant mask is applied to the semiconductor arrangement. The second implant mask and the first implant mask define a second implant region corresponding to an overlap between the first implant mask and the second implant mask

Methodology Applied
Scientific EffectIon Implantation: Ion Implantation

Data Source

PatentUS9087773B2Implant region definition
Publication Date: 2015.07.21 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US9087773B2 patent drawing
  • US9087773B2 patent drawing
  • US9087773B2 patent drawing

AI summary

Among other things, one or more systems and techniques for defining one or more implant regions or for doping a semiconductor arrangement are provided. A first implant region is defined based upon a first implant mask overlaying a first active region of a semiconductor arrangement. A second implant region is defined based upon the first implant mask and a second implant mask overlaying a second active region of the semiconductor arrangement. A third implant region is defined based upon the second implant mask overlaying a third active region of the semiconductor arrangement. One or more doping processes are performed through the first implant mask and the second implant mask to dope the semiconductor arrangement. Because the first implant mask and the second implant mask overlap the second active region, doping area coverage is improved thus mitigating undesirable voltage threshold variations otherwise resulting from inadequate doping area coverage.