Overlapping Electronic Module Layout for Smaller Footprint
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Solution Overview
Problem
The existing configurations of electronic modules with multiple semiconductor and piezoelectric substrates result in increased module size due to the larger plane area of these substrates, leading to space inefficiencies and potential thickness issues when mounted together.
Innovation Solution
A mountable electronic component configuration where a board with two electronic components, each with functional units on one surface and no functional units on the opposite surface, are mounted such that they overlap partially, allowing the non-functional surfaces to be exposed and covered by mold resin only on the edges, reducing the overall plane area and thickness while maintaining functional unit integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor substrates and piezoelectric substrates are mounted on the same surface, then the functional capabilities of the module are enhanced, but the plane area of the module increases
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional stacked arrangement by mounting electronic components on both the first main surface and second main surface of the board, with components on opposite surfaces overlapping when viewed from the thickness direction. This vertical stacking approach resolves the contradiction by accommodating multiple substrates in the thickness dimension rather than expanding the plane area.
2Reliability
If electronic components are mounted with functional units facing outward, then the electrical functional units are protected from damage, but the thickness of the component increases
Solution Approach 1:
The patent positions electrical functional units on the first and second main surfaces rather than on the thickness faces, allowing the components to be mounted with functional units facing outward on the board surfaces. This arrangement protects functional units while controlling thickness by utilizing the board's surface area rather than adding to the thickness dimension.
Data Source
AI summary
A board has a first main surface and a second main surface. A first electronic component is mounted on a board so that one surface on which an electrical functional unit is formed faces a first main surface. A second electronic component is mounted on the board so that one surface on which an electrical functional unit is formed faces a second main surface. At least a portion of the first electronic component and at least a portion of the second electronic component overlap each other in a plan view. The other surface of the first electronic component is exposed from a mold resin. The other surface of the second electronic component is exposed from a mold resin.