Overlapping PCB Ground Connection Layout for EMI Reduction
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Solution Overview
Problem
Electromagnetic interference between electrical components in slim electronic devices degrades performance due to concentrated circuit structures, leading to electromagnetic noise.
Innovation Solution
A circuit board assembly design featuring multiple conductive portions that electrically and mechanically connect overlapping printed circuit boards, including first, second, and third conductive portions, which reduce electromagnetic noise by connecting ground areas and surrounding components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electrical elements are concentrated in a limited space to support various functions, then the functionality of the electronic device is improved, but electromagnetic noise increases degrading performance
Solution Approach 1:
The circuit board assembly is divided into multiple printed circuit boards (first PCB, second PCB) that are disposed at different positions and orientations. By segmenting the concentrated circuit elements across separate boards rather than crowding them on a single board, the electromagnetic interference between elements is reduced while maintaining all required functionalities.
Solution Approach 2:
The patent transitions from a two-dimensional layout on a single circuit board to a three-dimensional arrangement with multiple PCBs at different heights and orientations. The first PCB and second PCB are disposed at different positions, creating vertical and spatial separation that reduces electromagnetic coupling while preserving all circuit functions.
2Device complexity
If a single circuit board is used to minimize structure complexity, then device complexity is reduced, but electromagnetic interference between components increases
Solution Approach 1:
The single circuit board is segmented into multiple printed circuit boards (first PCB, second PCB, third PCB) that are connected through conductive portions. This segmentation allows electromagnetic isolation between functional groups while maintaining electrical connectivity, reducing interference without significantly increasing overall structural complexity.
Solution Approach 2:
Conductive portions act as intermediaries connecting the multiple printed circuit boards. These conductive portions provide controlled electrical connections while allowing spatial separation between PCBs, serving as mediators that maintain electrical functionality while reducing electromagnetic interference through physical distancing.
3Volume of moving object
If electronic components are densely arranged to save space, then the device size is reduced, but electromagnetic noise degrades performance
Solution Approach 1:
The patent utilizes three-dimensional space by stacking multiple printed circuit boards at different heights and orientations. This vertical arrangement allows dense packing of functional components within a compact volume while maintaining electromagnetic isolation through spatial separation in the third dimension, thus reducing noise without increasing device footprint.
Solution Approach 2:
Multiple printed circuit boards are nested within each other in a compact arrangement, with the first PCB, second PCB, and third PCB disposed at different positions and orientations. This nested configuration maximizes space utilization while maintaining electromagnetic isolation between nested layers, achieving compact size without sacrificing performance.
Data Source
AI summary
According to an example embodiment of the disclosure, an electronic device may include a first printed circuit board, a second printed circuit board, multiple first conductive portions, multiple second conductive portions, and multiple third conductive portions. The second printed circuit board may be disposed to at least partially overlap the first printed circuit board. The multiple first conductive portions may be arranged in a first area between the first printed circuit board and the second printed circuit board. The multiple first conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple second conductive portions may be arranged in a second area, surrounding at least a part of the first area, between the first printed circuit board and the second printed circuit board. The multiple second conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple third conductive portions may be arranged in the second area. The multiple third conductive portions may electrically connect at least two of the multiple second conductive portions. The multiple second conductive portions may electrically connect a first ground area included in the first printed circuit board and a second ground area included in the second printed circuit board.