Overlapping Power Terminals for Low-Inductance Semiconductor Modules
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Solution Overview
Problem
The existing semiconductor module structures face challenges in miniaturization and increased manufacturing costs due to restrictive gate wiring layouts and the need for high-level assembly technology, while also struggling to suppress surge voltage during semiconductor element switching.
Innovation Solution
A semiconductor module design featuring power supply terminals with specific fastening and connection portions, and intermediate portions arranged with a predetermined gap, which allows for reduced wiring inductance and simplified assembly, thereby achieving miniaturization and cost reduction while effectively suppressing surge voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If main circuit wiring bars are arranged to face in parallel and close proximity above semiconductor elements to reduce wiring inductance, then surge voltage is suppressed, but gate wiring layout becomes restricted and module miniaturization becomes difficult
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement where wiring bars are placed above semiconductor elements to a three-dimensional configuration where wiring bars extend along side surfaces. This dimensional change allows wiring bars to achieve close proximity for low inductance while providing sufficient space for gate wiring layouts, resolving the conflict between surge voltage suppression and module miniaturization.
Solution Approach 2:
The wiring bar structure is segmented into multiple portions: a first portion extending along the side surface, a second portion extending from the first portion, and a third portion extending from the second portion. This segmentation allows different sections to fulfill different functions - some sections provide close proximity for low inductance while other sections provide space for gate wiring, thereby resolving the spatial conflict.
2Object-affected harmful factors
If main circuit wiring bars are arranged to face in parallel and close proximity above semiconductor elements, then wiring inductance is reduced, but high-level assembly technology is required which increases manufacturing cost
Solution Approach 1:
The patent merges the main circuit wiring bar function with the module case structure by forming the wiring bar as an integral part of the case or by closely integrating it with the case structure. This integration eliminates the need for separate high-precision assembly of wiring bars and reduces the requirement for high-level assembly technology, thereby lowering manufacturing costs while maintaining low inductance through close proximity arrangement.
3Reliability
If wiring bars are arranged in close proximity to suppress surge voltage, then switching performance is improved, but positions of semiconductor elements become restricted
Solution Approach 1:
By moving the wiring bar arrangement from above the semiconductor elements to along the side surfaces, the patent creates additional spatial freedom. This allows semiconductor elements to be positioned more flexibly on the insulating substrate while still maintaining close proximity between wiring bars for effective surge voltage suppression and improved switching performance.
Data Source
AI summary
The present invention is directed to provide a semiconductor module capable of achieving miniaturization and reduced manufacturing cost while suppressing surge voltage generated when switching the semiconductor elements. A semiconductor module includes a negative terminal and a positive terminal. The negative terminal has a negative fastening portion for fastening a negative polarity-side external terminal, a negative connection portion connected to a laminated substrate, and a negative intermediate portion arranged between the negative fastening portion and the negative connection portion. The positive terminal has a positive fastening portion for fastening a positive polarity-side external terminal, positive connection portions connected to the laminated substrate, and a positive intermediate portion facing the negative intermediate portion with a predetermined gap and arranged between the positive fastening portion and the positive connection portions.