Overlapping Semiconductor Modules on Printed Wiring Board
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Solution Overview
Problem
Power semiconductor modules face challenges in reducing loss and size while maintaining heat radiation efficiency, leading to increased costs and size due to the need for larger heat radiation surfaces when connected in parallel.
Innovation Solution
A semiconductor device configuration featuring a printed wiring board with overlapping first and second semiconductor modules, each with a heat radiator, allowing for parallel connection and efficient heat radiation without the need for special casings, reducing occupied area and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If multiple power semiconductor modules are connected in parallel to increase power handling capability, then the loss per module is reduced, but the heat radiation surface area must be increased leading to larger device size and higher cost
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of semiconductor modules to a three-dimensional stacked configuration. Multiple module stacks are vertically arranged on the printed circuit board, allowing heat radiation surfaces to face different directions (upward, downward, sideways) and thereby increasing the effective heat radiation area without proportionally increasing the device footprint.
Solution Approach 2:
The semiconductor device is divided into multiple independent module stacks, each containing semiconductor modules arranged in series. These stacks are connected in parallel through the printed circuit board, allowing independent heat radiation paths for each stack and enabling compact arrangement while maintaining high power handling capability.
2Loss of energy
If multiple power semiconductor modules are connected in parallel to increase power handling capability, then the loss per module is reduced, but the device cost increases due to larger heat radiation requirements
Solution Approach 1:
By stacking modules vertically and utilizing three-dimensional space, the patent reduces the required heat radiation surface area for a given power handling capability, thereby reducing material costs and overall device manufacturing cost while maintaining low loss operation.
Solution Approach 2:
The printed circuit board serves multiple functions: electrical connection between modules, mechanical support for module stacks, and heat conduction path from semiconductor elements. This multi-functionality reduces the need for separate components, simplifying manufacturing and reducing cost.
3Temperature
If semiconductor modules are arranged side by side to improve heat radiation, then the heat radiation surface area is increased, but the occupied area increases
Solution Approach 1:
The patent arranges semiconductor modules in a vertical stack configuration rather than side-by-side horizontal arrangement. Heat radiators are positioned to radiate heat in multiple directions (upward from top modules, downward from bottom modules, and sideways from intermediate modules), achieving high heat radiation efficiency within a compact vertical footprint.
Solution Approach 2:
Multiple semiconductor modules are nested vertically within a compact space, with each module stacked above or below another. This nesting arrangement allows efficient use of vertical space while maintaining adequate heat radiation pathways, reducing the horizontal occupied area compared to side-by-side arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration reduces the occupied area and improves heat radiation performance while minimizing costs by eliminating the need for special casings and simplifying wiring, allowing for efficient heat dissipation from both sides.
Implementation Method 1
a first heat radiation surface, the first package body including a first semiconductor element, the first heat radiation surface being provided on one surface of the first package body and configured to radiate heat generated in the first semiconductor element
Data Source
AI summary
A semiconductor device includes a printed wiring board; a first semiconductor module including a first package body and a first heat radiation surface on one surface of the first package body, another surface of the first package body, opposite to the first heat radiation surface, faces one face of the printed wiring board; a first heat radiator on the first heat radiation surface; a second semiconductor module including a second package body and a second heat radiation surface on one surface of the second package body, another surface of the second package body, opposite to the second heat radiation surface, faces another face of the printed wiring board; and a second heat radiator provided on the second heat radiation surface. The first and second semiconductor modules are arranged to overlap each other in a plan view. The second semiconductor module is connected in parallel to the first semiconductor module.