Overlapping Signal Lines in Array Substrates for Light Field Displays
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Solution Overview
Problem
Conventional light field display devices face challenges in reducing light-emitting point size and increasing density due to the large number of signal lines associated with each point, limiting pixel resolution.
Innovation Solution
An array substrate design where multiple first signal lines are located in different layers of an insulating spacer, with overlapping orthographic projections, reducing the overall width and allowing for smaller light-emitting points and increased density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If each light-emitting point is associated with a large number of signal lines, then the light-emitting point can be properly driven, but the light-emitting point size cannot be reduced and density distribution cannot be increased
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of signal lines to a three-dimensional stacked configuration using multiple insulating layers. Signal lines are arranged in different layers (first insulating layer, second insulating layer, third insulating layer) with overlapping projections, effectively utilizing the vertical dimension to reduce horizontal space requirements and enable smaller light-emitting point sizes.
Solution Approach 2:
The patent implements a nested structure where multiple signal lines are contained within different insulating layers that are stacked vertically. Each signal line is embedded in its own insulating layer, with lower layers positioned beneath upper layers, creating a nested configuration that consolidates multiple signal pathways into a compact vertical arrangement.
2Manufacturing precision
If the density distribution of light-emitting points is increased, then pixel resolution is improved, but the number of signal lines per point increases making it difficult to reduce point size
Solution Approach 1:
By arranging signal lines in multiple vertical layers with overlapping projections, the patent reduces the horizontal width required for signal line routing. This vertical stacking approach allows signal lines to share horizontal space across different layers, enabling higher density light-emitting point arrangements without increasing the overall device width.
Solution Approach 2:
The patent merges multiple signal line pathways into a compact configuration where signal lines from different layers overlap in their horizontal projections. This merging of spatial pathways allows multiple signal connections to coexist in a reduced horizontal footprint, supporting higher pixel density.
Data Source
AI summary
An array substrate is provided, including a substrate, wherein the substrate is provided with a plurality of electrodes and a plurality of first signal lines, each of the electrodes being correspondingly connected with a first signal line. In some examples, the first signal lines extend in the same direction. In some examples, at least two of the plurality of first signal lines are located in different layers of an insulating spacer from each other. In some examples, orthographic projections on the substrate of at least two of the first signal lines in the different layers at least partially overlap. Accordingly, a light field display device comprising the array substrate is also provided. The array substrate can reduce a light-emitting point size and increase a density distribution of light-emitting points.