Overlapping Thermal Pads for Compact PCB Heat Dissipation
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Solution Overview
Problem
The existing production methods for printed circuit boards (PCBs) are costly and inefficient, particularly when designing for multiple integrated circuits (ICs) with exposed pads, as they require separate PCBs for each IC, leading to wasted space and increased production and certification costs.
Innovation Solution
A PCB design featuring partially overlapping thermal pads on both sides, allowing for adaptable heat dissipation and accommodating different IC sizes, with optional thermal vias for enhanced heat transfer, enabling a single PCB to support multiple IC configurations and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate PCBs are designed for each IC with exposed pads, then each IC can be properly cooled, but the PCB size increases and production costs increase
Solution Approach 1:
The patent combines multiple thermal pad functions into a single shared thermal pad structure. Instead of providing separate thermal pads for each IC on opposite sides of the PCB, the invention merges them into one common thermal pad that serves multiple ICs simultaneously, thereby reducing the overall PCB area while maintaining effective heat dissipation for all connected ICs.
Solution Approach 2:
The shared thermal pad is designed to be universal, accommodating multiple different ICs with exposed pads that require thermal management. This multi-functional thermal pad can connect to various IC types (such as video serializers, deserializers, RF modulators) on the same side of the PCB, eliminating the need for dedicated thermal pads for each IC and reducing space consumption.
2Reliability
If separate PCBs are designed for each IC configuration, then each IC can be properly supported, but production and certification costs increase
Solution Approach 1:
The PCB design implements a universal interface through the shared thermal pad that can accommodate multiple different IC configurations. Instead of producing separate PCBs for each IC type, this single PCB design can support various ICs (video serializers, deserializers, RF modulators, etc.) by connecting them to the same thermal pad infrastructure, thereby reducing production complexity and certification costs.
Solution Approach 2:
The PCB layout allows dynamic configuration of IC connections to the shared thermal pad. The design enables flexibility in which ICs are connected to the thermal pad on the first side of the PCB, allowing the same PCB to be adapted for different IC combinations without requiring new PCB designs, thus reducing manufacturing and certification expenses.
3Temperature
If thermal pads are placed on both sides of the PCB for different ICs, then heat dissipation is improved, but the PCB becomes less compact
Solution Approach 1:
The patent merges the thermal pad functions from both sides of the PCB into a single shared thermal pad structure. Instead of maintaining separate thermal pads on opposite sides for different ICs, the invention combines them into one common thermal pad that handles heat dissipation for multiple ICs, thereby simplifying the PCB layout and reducing overall device complexity while preserving effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a more compact PCB that can accommodate various ICs, including video serializers and deserializers, radio frequency modulators, and other components, while significantly reducing production and certification expenses by utilizing unused space effectively.
Implementation Method 1
The PCB may further include a plurality of thermal vias, with one end of each thermal via connecting to the first thermal pad and the other end connecting to the second thermal pad
Data Source
AI summary
A printed circuit board includes a first thermal pad on a first side of the printed circuit board for a first integrated circuit having a first exposed pad and a second thermal pad on a second side of the printed circuit board for a second integrated circuit having a second exposed pad. The first thermal pad and the second thermal pad overlap at least partially to each other in a direction perpendicular to a plane of the printed circuit board.