Overlapping Via Cross-Section for Low Resistance Multilayer Wiring
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Solution Overview
Problem
Increased wiring resistance in multilayer boards with micro-wiring and small via diameters leads to insufficient power supply for semiconductor elements, hindering their operation, and existing methods to increase via density are inefficient.
Innovation Solution
The cross-sectional shape of vias is designed with overlapping similar shapes to increase the via's cross-sectional area, reducing wiring resistance and maintaining high-density wiring board capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If micro-wiring and extremely small via diameter are used to increase density, then the number of terminals and functionality increase, but wiring resistance increases causing insufficient power supply
Solution Approach 1:
The via is segmented into multiple overlapping cross-sectional shapes (e.g., multiple circles or polygons) that partially overlap with each other. This segmentation approach allows the via to maintain a compact footprint while increasing the effective conductive area, thereby reducing wiring resistance without increasing the overall via diameter.
Solution Approach 2:
The invention transitions from a single circular via cross-section to a composite shape formed by overlapping multiple similar shapes in the same plane. This dimensional approach within the cross-sectional area allows increasing the conductive path area without extending the via diameter, effectively addressing the resistance issue while maintaining high density.
2Reliability
If multiple vias with the same shape are provided to reduce wiring resistance, then power supply stability improves, but the surface area used by vias and connected conductors increases making density increase difficult
Solution Approach 1:
Multiple similar shapes (e.g., circles, polygons) are merged by overlapping them to form a single composite via cross-section. This merging creates an effective via with larger conductive area equivalent to multiple separate vias, but occupies less total surface area because the overlapping regions are shared, thus improving power supply stability while maintaining high density.
Solution Approach 2:
The via structure embeds multiple shape instances within a single via footprint by having them overlap and nest within the same boundary. This nesting approach allows the via to function as multiple conductive paths simultaneously while occupying the space of a single via, preventing the need for additional separate via structures.
Data Source
AI summary
A wiring board for mounting a semiconductor element or electronic component having a plurality of wiring layers, an insulating layer provided between these wiring layers, and a via which is provided to the insulating layer and which electrically connects the wiring layers. In this wiring board, the cross-sectional shape of the via in the plane parallel to the wiring layers is obtained by the partial overlapping of a plurality of similar shapes (circles). Stable operation can be obtained in a semiconductor element by minimizing obstacles to increased density, effectively increasing the cross-sectional area of the via, and preventing the wiring resistance from increasing by making the cross-sectional shape of the via into a shape obtained by the partial overlapping of a plurality of similar shapes.