Overlay Class F Choke for Multi-Band RF PA Impedance Tuning
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Solution Overview
Problem
Traditional multi-mode multi-band RF circuitry is bulky, costly, and power-intensive, failing to efficiently support various wireless communications protocols that require different modes and frequency bands while maintaining performance and efficiency.
Innovation Solution
The implementation of an overlay class F choke in RF power amplifier stages using mutually coupled class F inductive elements, which provides high efficiency and tunable impedance to support multiple communication modes and frequency bands with a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional multi-mode multi-band RF circuitry is used, then various wireless communications protocols can be supported, but the device becomes bulky, costly, and power-intensive
Solution Approach 1:
The patent combines multiple RF power amplifier circuits into a single integrated circuit that can operate across multiple frequency bands and modes. The overlay class F choke structure integrates multiple inductive elements in a compact arrangement, allowing the amplifier to support various wireless communications protocols without requiring separate discrete components for each band, thereby reducing overall device size while maintaining versatility
Solution Approach 2:
The RF power amplifier is designed with universal functionality to operate across multiple frequency bands (e.g., 800 MHz, 1.9 GHz, 2.6 GHz) and communication modes (half-duplex, full-duplex, TDD, FDD) using a single integrated circuit. The overlay class F choke provides tunable impedance that can be adjusted to match different band requirements, enabling one device to perform multiple functions that traditionally required separate circuits
2Adaptability or versatility
If traditional multi-mode multi-band RF circuitry is used, then various wireless communications protocols can be supported, but the cost increases
Solution Approach 1:
By merging multiple RF power amplifier circuits into a single integrated circuit with shared components (power supply, control logic, and the overlay class F choke structure), the patent reduces the total component count and manufacturing complexity. This integration approach lowers production costs compared to assembling multiple discrete amplifier circuits, while still providing support for various wireless communications protocols
3Adaptability or versatility
If traditional multi-mode multi-band RF circuitry is used, then various wireless communications protocols can be supported, but power consumption increases
Solution Approach 1:
The patent implements dynamic operation where the RF power amplifier can be selectively activated for specific frequency bands and modes based on communication requirements. The overlay class F choke provides dynamic impedance tuning capabilities that optimize power efficiency for different operating conditions. This dynamic approach allows the amplifier to consume power only when needed and at optimal efficiency levels for each specific mode, rather than continuously or at fixed suboptimal efficiency
Solution Approach 2:
The overlay class F choke structure enables parameter changes in impedance and operating frequency without requiring physical reconfiguration or additional components. By adjusting the electrical parameters of the coupled inductive elements, the amplifier can efficiently operate across different frequency bands and modes, maintaining optimal power efficiency throughout the parameter range rather than requiring separate optimized circuits for each band
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact, efficient, and cost-effective RF power amplifier that can operate in multiple modes and frequency bands, enhancing the performance and flexibility of wireless communications devices while minimizing power consumption.
Implementation Method 1
an overlay class F choke in RF power amplifier stages using mutually coupled class F inductive elements
Data Source
AI summary
Embodiments of the present disclosure relate to an overlay class F choke of a radio frequency (RF) power amplifier (PA) stage and an RF PA amplifying transistor of the RF PA stage. The overlay class F choke includes a pair of mutually coupled class F inductive elements, which are coupled in series between a PA envelope power supply and a collector of the RF PA amplifying transistor. In one embodiment of the RF PA stage, the RF PA stage receives and amplifies an RF stage input signal to provide an RF stage output signal using the RF PA amplifying transistor. The collector of the RF PA amplifying transistor provides the RF stage output signal. The PA envelope power supply provides an envelope power supply signal to the overlay class F choke. The envelope power supply signal provides power for amplification.