Overlay Measurement Recipe Optimization for Reliable Wafer Alignment
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Solution Overview
Problem
Current overlay measurement systems require manual input of recipes and optimization of measurement options, which is time-consuming and prone to errors due to the variability of technical skills and experiences of managers.
Innovation Solution
A manager program driven by a manager PC that allows the measurement device to perform optimization of measurement options based on data received from the manager PC, enabling remote and efficient recipe generation and optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual input and optimization of measurement options is performed by managers, then flexibility and adaptability are maintained, but time consumption increases and errors occur due to variability in technical skills
Solution Approach 1:
The measurement device performs self-optimization of measurement options by automatically analyzing recipe data and determining optimal parameters without requiring manual intervention from managers. The device uses its own processing capabilities to evaluate multiple options and select the best configuration, thereby eliminating time-consuming manual operations while maintaining or improving measurement reliability.
Solution Approach 2:
A communication interface acts as an intermediary between the external environment and the measurement device, enabling automatic transmission of recipe information and optimization parameters. This intermediary system facilitates the automated optimization process by handling data exchange and configuration transmission, reducing the need for manual input while ensuring accurate and consistent measurement settings.
2Productivity
If manual optimization of measurement options is performed, then measurement flexibility is maintained, but measurement efficiency decreases due to repetitive manual operations
Solution Approach 1:
The measurement device autonomously performs optimization of measurement options by evaluating recipe requirements and automatically selecting optimal parameters. This self-service capability eliminates the need for managers to manually repeat optimization operations, significantly improving measurement efficiency while reducing operational complexity. The device independently handles the entire optimization process from data analysis to parameter selection.
Solution Approach 2:
The system performs preliminary analysis of recipe data and pre-determines optimal measurement options before actual measurement begins. By conducting optimization in advance based on recipe characteristics, the system prepares optimal configurations ahead of time, reducing the operational burden during measurement execution and improving overall productivity.
3Reliability
If recipe optimization is performed manually, then adaptability to different measurement scenarios is maintained, but consistency and reliability vary due to human skill differences
Solution Approach 1:
The measurement device performs self-optimization using automated algorithms that consistently evaluate recipe requirements and determine optimal parameters. This self-service approach eliminates variability introduced by different managers' skills and experiences, ensuring uniform and reliable measurement consistency across all operations. The automated system applies the same rigorous evaluation criteria to every optimization task, guaranteeing repeatable results.
Solution Approach 2:
The optimization system automatically adjusts multiple measurement parameters based on recipe analysis, transforming qualitative recipe requirements into quantitative optimal settings. By systematically varying and evaluating different parameter combinations through automated algorithms, the system achieves consistent optimization results without requiring complex manual adjustments, thereby improving reliability while managing system complexity through structured parameter evaluation.
Data Source
AI summary
An overlay measurement device for measuring an error between a first overlay mark and a second overlay mark respectively formed on different layers of a wafer, includes: a light source; an objective lens that concentrates a beam from the light source on a measurement position of the wafer, and gathers the beam being reflected in the measurement positon; a lens focus actuator that adjusts a distance between the objective lens and the wafer such that a focus surface is placed at the first overlay mark or the second overlay mark; an auto focus module that adjusts a focus by adjusting the lens focus actuator; a detector for obtaining an image of the first overlay mark or an image of the second overlay mark; a transmission and receipt part; and a processor connecting to the transmission and receipt part electrically.