Power Overlay Tile Assembly for Repairable Low-Impedance Switching

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Solution Overview

Problem

Existing power distribution systems in aircraft and other applications face challenges with high inductance and impedance, leading to inefficiencies in power switching and increased costs due to non-repairable wire bond-based assemblies.

Innovation Solution

A modular power overlay architecture with interchangeable power switching components on substrates, utilizing solid state switches like SiC or GaN, and a base with seats for tiles, allowing for low inductance and impedance connections, enabling faster switching and repairability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If wire bond-based assemblies are used for power distribution, then electrical connections can be established, but inductance and impedance increase leading to power losses

Engineering Contradiction:

Improvepower lossesVSAvoidwire bond-based assemblies

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the wire bonds from the power distribution system, replacing them with a direct power overlay architecture where power switching components are mounted on substrates that form electrical connections without traditional wire bonds, thereby reducing inductance and impedance

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The power distribution system is segmented into modular power overlay tiles that can be independently configured and assembled, allowing optimization of electrical paths and reduction of parasitic inductance through localized power switching arrangements

Inventive Principle:

Principle #1Segmentation

2Ease of repair

If non-repairable wire bond-based assemblies are used, then power distribution can be implemented, but repairability and maintenance become difficult

Engineering Contradiction:

ImproverepairabilityVSAvoidnon-repairable assemblies

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The system is divided into discrete, replaceable power overlay tiles that can be independently removed and replaced, enabling modular repair strategies where faulty tiles are swapped out without requiring complex disassembly of the entire power distribution system

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The power overlay tiles are designed with standardized interfaces and mounting mechanisms that allow them to be universally applied in different positions and configurations, facilitating ease of replacement and maintenance while maintaining system functionality

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Speed

If traditional power distribution architecture is used, then power can be delivered, but switching speed is limited due to high inductance

Engineering Contradiction:

Improveswitching speedVSAvoidpower losses

Core Design Contradiction:

SpeedVSLoss of energy

Solution Approach 1:

By removing wire bonds and traditional interconnect structures that introduce parasitic inductance, the patent enables faster switching speeds while simultaneously reducing energy losses through direct electrical connections between power switching components and substrates

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the electrical parameters of the power distribution system by reducing parasitic inductance and impedance through the overlay architecture, thereby enabling higher switching frequencies and improved power delivery efficiency

Inventive Principle:

Principle #35Parameter changes

4Adaptability or versatility

If modular power overlay architecture is implemented, then repairability and configurability improve, but device complexity increases

Engineering Contradiction:

ImproveconfigurabilityVSAvoidmodular architecture

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

While segmentation into modular tiles increases physical component count, it enables standardized interfaces and simplified assembly procedures that reduce operational complexity and improve system configurability for different power distribution requirements

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250300435A1Power overlay architecture

Publication Date: 2025.09.25 GE AVIATION SYSTEMS LLC

AI summary

A power overlay module assembly that provides for or meets a desired power demand. The power overlay module assembly comprises power overlay tiles, a base, a direct current (DC) input bus bar, and an alternating current (AC) bus bar. The power overlay tiles have an arrangement of power switching components. The base receives the power overlay tiles. The DC input bus bar is electrically coupled to the power overlay tiles. The AC output bus bar comprises a non-conductive surface layer. The non-conductive surface layer insulates the AC output bus bar from the DC input bus bar, and the AC output bus bar is electrically coupled to the power overlay tiles.