Overmolded Battery Pack Circuit Board Mounting Against Moisture Ingress

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Solution Overview

Problem

Existing methods for securing components within traction battery packs are inefficient and prone to debris and moisture ingress, requiring complex assembly processes and additional fasteners.

Innovation Solution

The use of an overmolded covering to secure a circuit board within a frame, which is injected over the circuit board at low pressure, providing a secure and moisture-resistant encapsulation without the need for separate fasteners.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional fastening methods are used to secure the circuit board, then the assembly process requires multiple fasteners and complex steps, but this increases assembly time and complexity

Engineering Contradiction:
Improveassembly timeVSAvoidassembly complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges the circuit board securing function with the frame structure by integrating the circuit board directly into the frame body, eliminating the need for separate fasteners and reducing assembly steps to a single injection molding operation

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame is designed to serve multiple functions: it provides structural support, houses the circuit board, and integrates the circuit board securing function all in one component, reducing the need for additional fastening parts

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional fastening methods are used to secure the circuit board, then separate fasteners are required, but this allows debris and moisture to ingress at fastener locations

Engineering Contradiction:
Improveprotection against debris and moistureVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses a continuous frame structure that fully encloses the circuit board, creating a sealed environment that prevents debris and moisture ingress while eliminating gaps at fastener locations

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

By merging the circuit board securing function with the frame structure itself, the patent eliminates separate fasteners that would create potential ingress paths, achieving both simplified assembly and improved environmental protection

Inventive Principle:
Principle #5Merging (Combining)

3Strength

If multiple fasteners are used to secure the circuit board, then the assembly process becomes more complex, but this provides secure mounting

Engineering Contradiction:
Improvesecuring strengthVSAvoidassembly complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent merges the circuit board mounting function with the frame structure by integrating the circuit board directly into the frame body through injection molding, providing secure mounting without requiring multiple separate fasteners

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical fastening system with an injection molding process that integrates the circuit board into the frame, achieving secure mounting through material bonding rather than mechanical fasteners

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces assembly time and complexity while enhancing protection against debris and moisture, ensuring reliable electrical connections and monitoring capabilities.

Implementation Method 1

an overmolded covering that secures the circuit board to the frame

Methodology Applied
Scientific EffectInjection molding:

Implementation Method 2

the overmolded covering is an low-pressure overmolded covering

Methodology Applied
Scientific EffectLow-pressure overmolding:

Data Source

PatentUS20260066481A1Overmolded component of traction battery pack
Publication Date: 2026.03.05 FORD GLOBAL TECH LLC
  • US20260066481A1 patent drawing
  • US20260066481A1 patent drawing
  • US20260066481A1 patent drawing

AI summary

A traction battery pack assembly includes a frame; one or more busbars secured to the frame; a circuit board; and an overmolded covering that secures the circuit board to the frame. A traction battery pack circuit board securing method includes positioning a circuit board adjacent a frame. The frame is configured to hold a plurality of busbars of a traction battery pack. The method further includes overmolding the circuit board with a covering to secure the circuit board relative to the frame.