Overmolded Camera Module with Through-Silicon Vias
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Solution Overview
Problem
The assembly process of camera modules in consumer electronics is complex and time-consuming due to the need for precise positioning of image sensor dies within ceramic substrates, which increases the overall dimensions of the camera module.
Innovation Solution
An overmolded camera module design that eliminates the ceramic substrate by using a conductive via through the microelectronic die for electrical connections and a transparent member, allowing for a compact casing that reduces dimensions and simplifies assembly by omitting the need for a carrier boat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate is used to provide electrical connections around the image sensor die, then electrical connectivity is achieved, but the overall x, y, and z dimensions of the camera module increase
Solution Approach 1:
The patent extracts and eliminates the ceramic substrate from the camera module assembly. Instead of using a ceramic substrate to provide electrical connections, the invention uses through-silicon vias (TSVs) formed directly through the image sensor die to establish electrical connections, thereby removing the unnecessary ceramic substrate and reducing the overall module dimensions
Solution Approach 2:
The patent transitions from planar electrical connections on the ceramic substrate to three-dimensional vertical connections through the die using TSVs. This dimensional change allows electrical connections to be made through the thickness of the die rather than requiring lateral space around the die, significantly reducing the x, y, and z dimensions of the camera module
2Manufacturing precision
If a carrier boat is used to position and hold the image sensor die during assembly, then positioning accuracy is achieved, but assembly complexity and time increase
Solution Approach 1:
The patent merges the die attachment function and the electrical connection function into a single integrated structure. The TSVs are formed directly in the die during the same fabrication process that creates the image sensor, eliminating the need for separate carrier boats and multiple assembly steps. This integration simplifies the assembly process while maintaining positioning accuracy
Solution Approach 2:
The patent performs preliminary actions during die fabrication by pre-forming the TSVs and attaching contacts to the die背面 before the die is mounted in the final assembly. This preliminary preparation of electrical connections eliminates the need for complex positioning and connection operations during final assembly, reducing both assembly complexity and time
Data Source
AI summary
A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.