Overmolded Electronic Package Cover With Integrated Thermal Insert
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Solution Overview
Problem
Existing electronic package encapsulation methods fail to effectively integrate heat dissipation and electromagnetic protection while maintaining a compact and efficient design, often requiring additional components that complicate manufacturing processes.
Innovation Solution
A method involving an overmolded encapsulation cover with an insert made of heat-conducting or electromagnetic material, where the insert is partially or fully embedded within a thermosetting resin substrate, and secured using adhesive rings or strips, allowing for integrated heat dissipation and protection without increasing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If members are transferred onto covers after mounting and fixed by adhesive layers or beads, then heat dissipation and electromagnetic protection can be provided, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The insert is placed in the mold cavity before injecting the encapsulation material, so that the cover and insert are formed as a single integrated piece in one manufacturing step, eliminating subsequent assembly operations
Solution Approach 2:
The encapsulation cover and the functional insert (for heat dissipation or electromagnetic protection) are merged into a single molded component, combining multiple functions into one part
2Reliability
If additional components are added for heat dissipation and electromagnetic protection, then functional needs are met, but package size increases
Solution Approach 1:
Multiple functional components (encapsulation cover, heat dissipation element, electromagnetic shield) are merged into a single integrated molded part, maintaining compact package size while providing all required functions
Solution Approach 2:
The encapsulation cover is designed to perform multiple functions simultaneously: mechanical protection, heat dissipation, and electromagnetic shielding, through the integrated insert structure
3Reliability
If members are fixed to covers using adhesive layers or beads, then functional needs are met, but manufacturing time increases
Solution Approach 1:
The insert is positioned in the mold before the encapsulation material is injected, allowing the cover and insert to be formed together in a single molding operation, eliminating subsequent assembly steps
Solution Approach 2:
The cover and functional insert are combined into a single molded component, reducing multiple manufacturing steps into one efficient process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat dissipation and electromagnetic protection while maintaining a compact package size, simplifying manufacturing through a wafer-scale process that integrates the insert and adhesive within the encapsulation cover.
Implementation Method 1
injecting a coating material into said cavity; and setting the coating material in order to obtain an overmolded substrate within which said insert is at least partly included
Data Source
AI summary
A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.