Overmolded DIMM Cooling Structure for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing dual in-line memory module (DIMM) cooling systems are difficult for users to install and replace due to the need for thermal interface material and metal spreader plates, which complicate heat transfer and increase thermal impedance.
Innovation Solution
An overmolded DIMM cooling structure using injectable/castable thermal material that encapsulates the DIMM, eliminating the need for thermal interface material and metal spreader plates, and incorporating a conductive plate for improved thermal conductivity, allowing for efficient heat transfer to liquid cooled pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface material and heat spreaders/latches are used to couple DIMMs to cooling pipes, then heat transfer is achieved, but installation and removal become difficult and device complexity increases
Solution Approach 1:
The patent combines the thermal interface material, heat spreader, and retention latches into a single integrated overmolded assembly. The DIMM is permanently encapsulated with thermal material that directly contacts the cooling pipe, eliminating the need for separate thermal interface materials and heat spreaders. The retention latches are integrated into the molding, creating a unified structure that simplifies both installation and removal operations.
Solution Approach 2:
The overmolded assembly serves multiple functions simultaneously: it provides thermal conduction from the DIMM to the cooling pipe, structural support for the DIMM, retention through integrated latches, and accommodation of dimensional variations. This multi-functional design eliminates the need for multiple separate components, reducing complexity while maintaining effective heat transfer.
2Reliability
If rigid thermal interface materials and heat spreaders are used, then thermal contact is established, but accommodation of DIMM thickness and dimensional variations is poor
Solution Approach 1:
The patent uses compliant thermal material with adjustable physical properties, specifically材料的柔软性和可压缩性, to adapt to different DIMM thicknesses and dimensional variations. The thermal material's compliance allows it to deform and maintain consistent thermal contact across varying DIMM dimensions, achieving reliable heat transfer without requiring precise dimensional matching.
Solution Approach 2:
The overmolded assembly uses composite construction combining the DIMM, compliant thermal material, and structural molding elements. This composite structure allows the thermal material to conform to dimensional variations while the outer molding provides structural integrity and retention, simultaneously achieving both thermal contact quality and adaptability to dimensional variations.
3Reliability
If multiple separate components (thermal interface material, heat spreaders, latches) are used, then thermal conduction is achieved, but the number of parts increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple separate components into a single overmolded assembly. The thermal interface material, heat spreader, and retention latches are all integrated into one unified structure through overmolding, reducing the part count from multiple separate components to a single integrated unit while maintaining all necessary thermal conduction functions.
Solution Approach 2:
The single overmolded assembly performs multiple functions that previously required separate components: thermal conduction, structural support, retention, and accommodation of dimensional variations. This multi-functional design reduces device complexity by eliminating the need for multiple separate parts while maintaining all necessary functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy user installation and replacement of DIMMs, reduces thermal impedance, and maintains consistent thermal performance across varying DIMM thicknesses and dimensions, while improving thermal conductivity and simplifying the cooling process.
Implementation Method 1
The thermal material (104) is part of a thermal interface (107) that is used for transferring heat from the DIMM (102) to a cooling manifold (130)
Implementation Method 2
The thermal material (104) is compliant enough so that it will compress when installed against a cold cooling manifold (130)
Data Source
AI summary
Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.