Overmolded Electronics Module Hermetic Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing implantable medical devices, such as leadless cardiac pacemakers, face challenges in achieving a compact design while maintaining hermetic sealing and efficient component integration, which affects their size, battery life, and processing power.
Innovation Solution
The implementation of an electronics module with a potting material and a metallic layer provides a hermetic seal, allowing for a more compact design by eliminating the need for a pre-formed metallic housing, and enabling longer battery life and increased circuitry space through the use of over-molded components and fixation mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pre-formed metallic housing is used to seal the electronics module, then hermetic sealing is achieved, but the device size increases and compactness is reduced
Solution Approach 1:
The patent combines the sealing function with the potting material that already encapsulates the electronics module. The metallic layer is deposited directly on the potting material surface, merging the sealing function with the existing structural component rather than adding a separate housing.
Solution Approach 2:
The patent uses a thin metallic layer (such as Parylene or other thin film materials) to provide hermetic sealing. This thin film approach replaces the bulky pre-formed metallic housing while maintaining the sealing function, significantly reducing device volume.
2Reliability
If a pre-formed metallic housing is used to encase the electronics module, then component protection is achieved, but the circuitry space is reduced
Solution Approach 1:
The protective sealing function is merged with the potting material that already serves as a structural support and component mounting substrate. This integration eliminates the need for additional protective housing space.
Solution Approach 2:
The patent uses a composite structure combining the potting material (such as epoxy or silicone) with a deposited metallic layer. This composite approach provides both mechanical support and hermetic protection within a compact volume, maximizing available circuitry space.
3Reliability
If the electronics module is hermetically sealed prior to assembly, then component protection is improved, but the manufacturing complexity increases
Solution Approach 1:
The electronics module is hermetically sealed in advance by depositing the metallic layer on the potting material before final device assembly. This preliminary sealing action simplifies the overall manufacturing process by eliminating the need for complex post-assembly sealing operations.
Solution Approach 2:
The patent changes the state of the sealing from a mechanical assembly operation to a deposition process. By using physical vapor deposition or chemical vapor deposition to apply the metallic layer, the sealing process becomes more controllable and integrates better with automated manufacturing.
4Volume of moving object
If the device is made more compact, then implantability is improved, but the battery life is reduced
Solution Approach 1:
The composite structure of potting material with deposited metallic layer provides efficient space utilization. This allows the battery to be positioned optimally within the compact device volume, maximizing energy density and extending battery life despite the reduced overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more compact and efficient implantable medical device with improved hermetic sealing, extended battery life, and enhanced processing capabilities, facilitating better cardiac monitoring and therapy delivery.
Implementation Method 1
a metallic layer that is provided on an outer surface of the circuit sub-module that conforms to the outer surface of the circuit sub-module
Implementation Method 2
a potting material supporting the plurality of electrical components, wherein the plurality of electrical components and the potting material form a circuit sub-module
Data Source
AI summary
An electronics module for use in an Implantable Medical Device (IMD) may include a plurality of electrical components connected to form a circuit that includes a terminal and a potting material that supports the plurality of electrical components. The plurality of electrical components and the potting material together form a circuit sub-module in which the terminal is accessible from outside of the circuit sub-module. A metallic layer that conforms to an outer surface of the circuit sub-module is provided thereon such that the terminal is accessible from outside of the metallic layer.