Overmolded Electronic Eyewear Frame with Segmented Wall Structure

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Solution Overview

Problem

The existing injection molding processes for electronic eyewear devices often result in sink marks due to uneven wall thicknesses and face challenges in integrating additional electronics, which increases cycle time and may require detrimental temperatures, affecting the integrity of components.

Innovation Solution

An overmolding process where a frame insert made of a first material is attached to a mold without contacting other areas, and a second material is used to partially encase it, minimizing wall thickness variations and allowing for the integration of electronics while maintaining the integrity of the component.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional injection molding is used to form the frame, then the manufacturing process is simple, but sink marks occur due to uneven wall thicknesses

Engineering Contradiction:
Improvemolding process simplicityVSAvoidsurface quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The frame is divided into a base frame structure and separate wall portions that are formed independently through the overmolding process. This segmentation allows each wall portion to be precisely controlled for thickness and surface quality while maintaining the overall frame structure, eliminating sink marks caused by uneven wall thicknesses in traditional single-step injection molding.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The base frame is pre-formed and positioned in the mold before the wall portions are injected. This preliminary action establishes the frame structure first, allowing subsequent wall portions to be added with controlled thickness and uniform surface quality, preventing sink marks that would occur if all portions were molded simultaneously.

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If additional electronics are integrated into the frame, then the device functionality is enhanced, but the cycle time increases and temperatures may affect component integrity

Engineering Contradiction:
Improveelectronics integration capabilityVSAvoidmolding cycle time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

Electronics are nested within recesses or cavities formed in the base frame structure before the wall portions are overmolded. This nesting approach allows electronics to be integrated without requiring separate molding steps, as the wall portions are formed to enclose the electronics simultaneously with the frame structure, maintaining cycle time while enabling functionality enhancement.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The molding process uses controlled temperature parameters and pressure variations during the overmolding phase to accommodate electronics integration. By adjusting these parameters during the wall portion formation, the process can enclose electronics without subjecting them to detrimental temperatures, thus integrating functionality while preserving component integrity and managing cycle time.

Inventive Principle:
Principle #35Parameter changes

3Strength

If wall thickness is increased to improve structural integrity, then the frame strength is enhanced, but the appearance quality deteriorates due to visible thickness variations

Engineering Contradiction:
Improveframe structural integrityVSAvoidsurface uniformity
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

Different wall portions are formed with locally optimized thicknesses that provide sufficient structural integrity at critical locations while maintaining uniform appearance at visible surfaces. The overmolding process allows selective thickness control in different regions, enabling strength enhancement where needed without compromising surface uniformity and appearance quality.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The frame combines a base frame material with overmolded wall portion materials that have different properties. This composite structure allows the base frame to provide structural integrity while the overmolded wall portions provide uniform surface appearance, as the second material can be precisely controlled to eliminate thickness variations visible on the exterior surface.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11897215B2Overmolded electronic eyewear device frame
Publication Date: 2024.02.13 SNAP INC
  • US11897215B2 patent drawing
  • US11897215B2 patent drawing
  • US11897215B2 patent drawing

AI summary

A process of overmolding a frame of a portable eyewear electronic device and a frame produced by the process is presented. A frame that includes a first material and includes a releasably mountable feature is attached to the mold in a desired position and does not contact other areas of the mold. The mold is filled with a second material to at least partially encase the frame insert.