Overmolded Heat Spreader for Hand-Held Device Thermal Management
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Solution Overview
Problem
Conventional cooling methods in mobile devices, relying on thermally conductive materials like copper, are insufficient for managing heat in miniaturized, high-power devices due to the thermal insulating properties of thermoplastics used in device mechanics, leading to localized high temperatures and inefficient heat spreading.
Innovation Solution
Integration of a thermally conductive graphite foil or metal heat spreader within a polymer structure, overmolded into the device's frame, providing structural support and thermal insulation, allowing for efficient heat management and distribution while maintaining mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermoplastics are used for device mechanics, then manufacturing ease and structural support are improved, but thermal conductivity deteriorates causing localized high temperatures
Solution Approach 1:
The patent applies composite materials by combining thermoplastic polymer with thermally conductive graphite particles. The graphite particles are dispersed within the polymer matrix to create a composite material that maintains the manufacturing advantages of thermoplastics while significantly improving thermal conductivity. This resolves the contradiction by enabling both ease of manufacture and effective heat dissipation.
2Volume of moving object
If device miniaturization is pursued, then device compactness is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent changes the thermal conductivity parameter of the device mechanics by incorporating graphite particles into the polymer matrix. This parameter change enables effective thermal management in miniaturized devices by enhancing the heat dissipation capability of the compact structure, thus resolving the contradiction between device size and thermal management.
3Power
If higher power levels are applied, then device functionality is improved, but component temperatures increase
Solution Approach 1:
The patent introduces graphite particles as an intermediary thermal management element within the polymer matrix. These particles act as heat conduits that facilitate heat transfer away from high-power components, enabling higher power levels to be applied without excessive temperature increases. The graphite particles mediate between the heat-generating components and the surrounding polymer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces component temperatures, enables higher power levels in miniaturized devices, and prevents uncomfortable heat buildup, enhancing thermal management and device reliability without increasing device size.
Implementation Method 1
heat spreader made from a thermally conductive material
Implementation Method 2
molded polymer material which forms a thermal insulator on the heat spreader
Data Source
AI summary
A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.