Overmolded Ink Delivery Device Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current ink delivery devices in printers are constrained by the size of the ink die due to adhesive limitations, making it difficult to further reduce their size without compromising printing functionality and increasing manufacturing complexity.
Innovation Solution
An overmolded ink delivery device with an encapsulated ink die and a wider adhesive surface allows for a smaller ink die size without affecting the printhead's functionality, providing additional structural support and spacing between ink dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the ink die size is reduced to decrease device size, then the device size is reduced, but the adhesive cannot adequately attach the ink die and the ink slot may be covered
Solution Approach 1:
The invention separates the adhesive attachment function from the ink die structure by introducing an overmold layer. The adhesive attaches to the overmold's outer surface rather than directly to the ink die, dividing the components so that the ink die can be small while the adhesive interface remains sufficiently large for reliable attachment.
Solution Approach 2:
The overmold acts as an intermediary layer between the adhesive and the ink die. This intermediate structure allows the adhesive to bond to a larger surface area on the overmold while the ink die itself remains compact, resolving the conflict between small size and adequate adhesion.
2Volume of moving object
If the ink die size is reduced, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The overmold combines multiple functions into a single integrated component: it provides structural support for the reduced-size ink die, creates the adhesive bonding interface, and maintains proper spacing between adjacent ink dies. This merging simplifies manufacturing by eliminating the need for separate adhesive application steps and complex alignment procedures.
Solution Approach 2:
The overmold serves multiple purposes simultaneously: it acts as a structural support, an adhesive substrate, and a spacing element between adjacent ink dies. This multi-functionality reduces the number of separate components and manufacturing steps required, thereby reducing overall manufacturing complexity despite the reduced ink die size.
3Volume of moving object
If the ink die size is reduced, then device size is reduced, but spacing between ink dies becomes insufficient
Solution Approach 1:
The overmold extends the spacing function from the horizontal plane to the vertical dimension by adding height to the structure. This allows the ink dies to be closer together horizontally while the overmold's vertical presence maintains adequate spacing and prevents interference between adjacent dies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the reduction of ink die size without altering the printhead's design, improving adhesion and reducing breakage rates, while maintaining printing performance and simplifying manufacturing processes.
Implementation Method 1
The overmold may include a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.