Overmolded Electronic Module with Integrated SMT Shield Walls
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Solution Overview
Problem
Existing electromagnetic shielding techniques for electronic modules, such as stamped metal shields, increase module size and require additional manufacturing steps, limiting miniaturization and efficiency.
Innovation Solution
The integration of SMT shield wall components with a conductive layer and a sacrificial non-conductive portion, allowing for overmolded electromagnetic shielding that is compatible with existing SMT component assembly processes and does not require a separate shield or installation step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a stamped metal shield is used for electromagnetic shielding, then shielding effectiveness is improved, but module size increases and manufacturing complexity increases
Solution Approach 1:
The patent combines the electromagnetic shield with the circuit board by integrating conductive shielding structures directly into the board layers. The shield is formed by conducting material embedded within the circuit board itself, eliminating the need for a separate stamped metal shield component. This merging of the shield into the existing circuit board structure provides electromagnetic shielding without increasing overall module size.
Solution Approach 2:
The circuit board serves multiple functions: it provides mechanical support for components, electrical connections through traces, and electromagnetic shielding through integrated conducting material. The shielding structure is incorporated as part of the circuit board's multi-layer construction, allowing the same component to fulfill both structural/electrical and shielding roles simultaneously.
2Object-affected harmful factors
If a stamped metal shield is used for electromagnetic shielding, then shielding effectiveness is improved, but manufacturing steps increase
Solution Approach 1:
The shielding function is merged into the circuit board manufacturing process itself. The conducting material for shielding is embedded within the circuit board layers during board fabrication, so the shield is created simultaneously with the circuit board rather than as a separate post-processing step. This eliminates the need for separate shield attachment operations.
Solution Approach 2:
The electromagnetic shielding structure is prepared and integrated into the circuit board during the board fabrication process, before the board is assembled with other module components. The shielding material is placed and bonded within the board layers as part of the initial board construction, rather than being added later as a separate manufacturing step.
3Object-affected harmful factors
If a stamped metal shield is used for electromagnetic shielding, then shielding effectiveness is improved, but the additional size required limits miniaturization
Solution Approach 1:
The shield is merged into the circuit board structure, utilizing the board's existing space and material layers. The conducting shielding material is embedded within the multi-layer board construction, sharing the same physical envelope as the circuit board itself. This eliminates the need for additional space that would be required for a separate stamped shield, enabling continued miniaturization of the module.
4Object-affected harmful factors
If separate shield and separate process for installing shield are used, then shielding effectiveness is improved, but manufacturing time and complexity increase
Solution Approach 1:
The shield manufacturing and circuit board manufacturing are merged into a single integrated process. The conducting shielding material is embedded within the circuit board layers during board fabrication, so the shield is created simultaneously with the circuit board rather than as a separate post-processing step. This eliminates the need for separate shield attachment operations and reduces total manufacturing time.
Solution Approach 2:
The electromagnetic shielding structure is prepared and integrated into the circuit board during the board fabrication process, before the board is assembled with other module components. The shielding material is placed and bonded within the board layers as part of the initial board construction, rather than being added later as a separate manufacturing step, thereby eliminating subsequent installation time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective electromagnetic shielding without increasing the module size, maintains mechanical stability, and simplifies the manufacturing process by using existing SMT component assembly methods, while minimizing space occupation and facilitating singulation.
Implementation Method 1
electromagnetic shielding be provided to attenuate electromagnetic energy to limit potentially adverse effects
Data Source
AI summary
According to certain aspects, a circuit board panel includes a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.