Overmolded Package Connectors for Heat Sink Clearance
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Solution Overview
Problem
The challenge in the computing industry is to achieve higher input/output (IO) speeds and throughput while minimizing signal loss during signal transmission from processing packages to main boards, which is hindered by the difficulty in attaching and detaching cables due to the presence of heat sinks and other components on the board, leading to potential damage and interference.
Innovation Solution
The solution involves a male connector with an overmolded cable structure that flattens and molds into shapes like sigmoid or angled forms to avoid impeding structures, coupled with a female connector using SMT pins and spring mechanisms to secure and eject the male connector without removing the heat sink, ensuring secure contact and easy disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a traditional socket connection is used on the main board, then signal transmission can be achieved, but signal loss increases and the cable cannot be easily attached or detached due to heat sink interference
Solution Approach 1:
The patent extracts the cable connection function from the traditional socket on the main board and relocates it to a dedicated processing package. This separation allows the cable to connect directly to the processing package without interfering with the heat sink or other board components, thereby reducing signal loss and enabling easy attachment and detachment.
Solution Approach 2:
The patent introduces a processing package as an intermediary component between the cable and the main board. This processing package integrates the socket connection and includes a heat sink, allowing the cable to connect without direct interference from the main board's heat sink or other components, thus reducing signal loss and facilitating easy connection operations.
2Ease of operation
If the cable is attached near the heat sink, then connection is possible, but the heat sink and other components impede the path and cause potential damage
Solution Approach 1:
The patent segments the system into distinct functional modules: the processing package with integrated socket and heat sink, and the main board. This segmentation allows the cable to connect to the processing package in a dedicated area free from interference by the main board's heat sink or other components, enabling easy connection while avoiding harmful interference.
Solution Approach 2:
The processing package serves as an intermediary that houses both the socket connection and the heat sink for the processing device. This configuration allows the cable to connect without being impeded by the heat sink or other components, as the processing package provides a dedicated connection area that isolates the cable path from harmful factors.
3Loss of energy
If the socket is placed on the main board, then signal transmission is achieved, but signal loss occurs during transmission from package to socket to board
Solution Approach 1:
The patent extracts the socket connection from the main board and integrates it into the processing package. This extraction shortens the signal transmission path by eliminating the intermediate step from package to socket to board, thereby reducing signal loss while maintaining functional simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates faster data communication by allowing cable connection and disconnection from processing packages without removing the heat sink, reducing signal loss and preventing damage to the package or board, while maintaining secure contact and easy ejection.
Implementation Method 1
a spring to move the male connector from an engaged position with the female connector to a disengaged position from the female connector
Data Source
AI summary
Connectors for processing packages are disclosed herein. An example male connector includes a plurality of wires. The example male connector further includes a socket pin. The example male connector further includes a paddle board connected to the socket pin. The example male connector further includes an overmolded cable housing the plurality of wires, the overmolded cable coupled to the paddle board, one of the plurality of wires coupled to the socket pin via the paddle board. The example male connector further includes a molded region to encompass the plurality of wires within a flat portion, the overmolded cable housing and the molded region to increase a height of the wires from the paddle board from a first height to a second height.