Overmolded Power Module for Electric Machine Thermal Dissipation
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Solution Overview
Problem
Electronic power modules for electric machines require specialized production lines, leading to high production costs and complex manufacturing processes.
Innovation Solution
A compact electronic power module with a plane substrate overmoulded with electrically insulating material and power traces, allowing for standard manufacturing methods like silk-screen printing and surface-mounted components, integrated with a support for efficient thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specialized production lines are used for electronic power modules, then manufacturing precision and reliability are improved, but production costs and device complexity increase
Solution Approach 1:
The plane substrate is designed to serve multiple functions simultaneously: it provides mechanical support for electronic components, establishes electrical connections through integrated power traces, and enables thermal dissipation through its structural design. This multi-functionality allows standard production lines to manufacture the module without requiring specialized equipment, thereby reducing production complexity while maintaining reliability
2Manufacturing precision
If specialized production lines are used for electronic power modules, then manufacturing precision is improved, but production costs increase
Solution Approach 1:
The patent merges the power traces directly into the plane substrate structure, eliminating the need for separate connection elements and reducing the number of assembly steps. This integration allows the module to be manufactured using standard PCB fabrication techniques and conventional electronic component assembly processes, significantly reducing production costs while maintaining manufacturing precision through standardized processes
3Productivity
If compact design is implemented, then productivity is improved, but thermal dissipation becomes more difficult
Solution Approach 1:
The plane substrate incorporates localized thermal management features including open cavities positioned beneath power traces and electronic components. These cavities create direct thermal pathways from high-heat-generation areas to the dissipation structure, enabling effective heat removal in the compact module design. The local quality modification maintains thermal performance while preserving the compact form factor that improves productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs, simplifies assembly, and enhances thermal dissipation, increasing the lifespan of components and reducing production time while maintaining efficient electrical connections.
Implementation Method 1
a plane substrate comprising at least one power trace overmoulded at least in part with electrically insulating material
Implementation Method 2
an electronic power module support comprising a reception cavity for receiving the electronic power module, the reception cavity comprising a bottom from which there extends in a substantially perpendicular manner at least one protuberance of the support
Data Source
AI summary
An electronic power module may be integrated into a voltage converter. Additionally, the electronic power module may include a plane substrate with at least one power trace overmolded at least in part with electrically insulating material. Further, the plane substrate may have an upper face to receive at least one electronic component so as to be connected electrically to the at least one power trace.